5G Antenna Module Layout for Shared PCB Ground and Legacy Antennas
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Solution Overview
Problem
The challenge of integrating a 5G antenna module and legacy antennas in electronic devices is exacerbated by the limited internal space, as the 5G antenna requires an array of antenna elements, increasing the overall size.
Innovation Solution
The electronic device incorporates a housing design with a first and second plate, a side member, a first PCB, and a 5G antenna module with a second PCB and conductive layers, allowing the 5G antenna module to utilize the conductive layer as a radiator and the legacy antenna to operate efficiently within a limited space.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If a 5G antenna module with an array of antenna elements is integrated into an electronic device, then 5G communication capability is achieved, but the mounting space required increases
Solution Approach 1:
The patent combines the 5G antenna module and legacy antenna into a single integrated antenna module. The conductive layer serves dual purposes: as part of the 5G antenna array structure and as the radiator for the legacy antenna, eliminating the need for separate antenna components and reducing overall mounting space.
Solution Approach 2:
The conductive layer is designed to perform multiple functions simultaneously: it acts as a structural element of the 5G antenna array, serves as the radiator for legacy antenna operations, and provides electromagnetic shielding. This multi-functionality allows the electronic device to support both 5G and legacy communications within a compact form factor.
2Device complexity
If the 5G antenna module uses a conductive layer as part of its structure, then the number of components is reduced, but the legacy antenna performance must be maintained
Solution Approach 1:
The patent applies local quality by designing specific regions of the conductive layer with different characteristics. Certain areas are optimized for 5G antenna array functionality while other regions are configured to serve as effective radiators for legacy antenna operations, ensuring both functions perform reliably despite using a shared structure.
Solution Approach 2:
The patent utilizes parameter changes by adjusting the electrical length, geometry, and positioning of the conductive layer to achieve resonance at legacy antenna frequencies. By modifying these parameters, the conductive layer can effectively function as a radiator for legacy communications while maintaining its role in the 5G antenna structure.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration reduces the mounting space required for both the 5G and legacy antennas, maintaining their performance levels while allowing for a more compact electronic device design.
Implementation Method 1
at least one conductive layer between the first surface and the second surface, and an antenna array paralleled to the first surface and formed on the first surface or in the second PCB, a first wireless communication circuit transmitting and/or receiving a first signal including a first frequency between 600 MHz and 6 GHz and electrically connected to one point of the at least one conductive layer providing an electrical length corresponding to the first frequency
Implementation Method 2
an antenna array paralleled to the first surface and formed on the first surface or in the second PCB, a second wireless communication circuit electrically connected to the antenna array and transmitting and/or receiving a second signal including a second frequency between 6 GHz and 100 GHz
Data Source
Figure 1
Figure 2
Figure 3A~3B
AI summary
An electronic device may include a first PCB including a non-conductive region and a conductive region operating as a ground, a first wireless communication circuit disposed on the first PCB, and a 5th generation (5G) antenna module disposed adjacent to the first PCB. The 5G antenna module may include at least one second PCB including an antenna array and a conductive layer operating as a ground of the antenna array and a second wireless communication circuit electrically connected to the antenna array. The second PCB may include a first portion and a second portion having a predetermined angle with the first portion. The first portion may be disposed adjacent to the non-conductive region and at least part of the second portion may be disposed adjacent to the conductive region. The first wireless communication circuit may be electrically connected to a first point of the conductive layer included in the first portion and transmitting or receiving a first RF signal in a first frequency band by using the conductive region and at least part of the conductive layer. The second wireless communication circuit may transmit or receive a second RF signal in a second frequency band by using the antenna array. Besides, various embodiments as understood from the specification are also possible.