5G Multi-Layer Patch Antenna for Broadband Radiation in Devices

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Solution Overview

Problem

5G antennas in electronic devices operating in the millimeter wave band face challenges with signal radiation due to the planar substrate structure, which limits bandwidth characteristics and is obstructed by display or metal regions, necessitating improved radiation performance and broadband capabilities.

Innovation Solution

The implementation of a multi-layer substrate array antenna with patch antennas, ground layers, and vias, along with parasitic patches and EBG structures, allows for beamforming and dual polarization, enabling signal radiation through non-metal regions and enhancing broadband performance.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Device complexity

If a 5G antenna is printed on a planar substrate inside the electronic device, then the antenna can be integrated into the device structure, but the signal radiation is blocked by the display region or metal body

Engineering Contradiction:
Improveantenna integrationVSAvoidsignal radiation performance
Core Design Contradiction:
Device complexityVSReliability

Solution Approach 1:

The patent transitions from a planar 2D substrate to a 3D multi-layer structure with alternating dielectric and conductive layers. This dimensional change allows the antenna to radiate signals in multiple directions rather than being constrained to a single plane, thereby overcoming the blocking effect of the display region or metal body while maintaining integration within the device.

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

Solution Approach 2:

The patent embeds the multi-layer antenna structure within the existing electronic device architecture, nesting the antenna between the display region and metal body rather than placing it on the outer surface. This nested configuration allows the antenna to operate within the device's internal space while avoiding signal blocking from external metal components.

Inventive Principle:
Principle #7Nested doll (Nesting)

2Speed

If an antenna operates in the millimeter wave band (e.g., 64 GHz), then high-speed communication is achieved, but broadband characteristics are limited due to the planar structure

Engineering Contradiction:
Improvedata rateVSAvoidbandwidth characteristics
Core Design Contradiction:
SpeedVSAdaptability or versatility

Solution Approach 1:

The multi-layer 3D structure provides additional spatial dimensions for electromagnetic wave propagation, enabling broader bandwidth operation. The vertical stacking of dielectric and conductive layers creates multiple radiation paths and resonant modes, allowing the antenna to achieve broadband characteristics necessary for high-speed millimeter wave communication.

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

Solution Approach 2:

The patent employs composite material construction with alternating dielectric layers (having different permittivity values) and conductive layers. This composite structure enables impedance matching and broadband operation by controlling the electromagnetic field distribution across multiple materials with different properties, thereby achieving both high data rate and wide bandwidth.

Inventive Principle:
Principle #40Composite materials

3Reliability

If multiple array antennas are disposed in the electronic device for 5G service, then communication coverage is improved, but interference between antennas increases

Engineering Contradiction:
Improvecommunication coverageVSAvoidantenna interference
Core Design Contradiction:
ReliabilityVSObject-generated harmful factors

Solution Approach 1:

The patent divides the antenna system into multiple independent array elements with distinct multi-layer structures. Each array element operates as a separate unit with its own feeding network, allowing for spatial separation and reduced mutual interference while maintaining overall communication coverage through coordinated operation of multiple segments.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The patent introduces dielectric layers as intermediary structures between adjacent antenna arrays. These dielectric layers act as isolation barriers that reduce electromagnetic coupling and interference between neighboring antennas, allowing multiple array antennas to coexist within the device without significant mutual interference.

Inventive Principle:
Principle #24Intermediary (Mediator)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This configuration improves radiation performance, achieves broadband characteristics, and allows signal transmission through non-metal regions, effectively addressing the limitations of planar substrate antennas.

Implementation Method 1

Such an antenna printed on a planar substrate radiates a signal in a direction perpendicular to the substrate

Methodology Applied
Scientific EffectElectromagnetic radiation: Electromagnetic Induction

Data Source

PatentUS11929564B2Electronic device comprising 5G antenna
Publication Date: 2024.03.12 LG ELECTRONICS INC
  • US11929564B2 patent drawing
  • US11929564B2 patent drawing
  • US11929564B2 patent drawing

AI summary

Provided is an electronic device comprising an antenna for 5G communication according to the present invention. The electronic device comprises an array antenna which is implemented as a multi-layer substrate inside the electronic device and includes multiple antenna elements. Each of the multiple antenna elements of the array antenna may comprise: a patch antenna disposed on a specific layer of the multi-layer substrate and including a first patch and a second patch which are spaced a predetermined distance apart from each other; and a ground layer disposed under the patch antenna and having a slot. Meanwhile, the first patch and the second patch may be connected to the ground layer through multiple vias, and the multiple vias may be arranged in the longitudinal direction of the slot while being adjacent to the slot.