8-Shaped Inductor Layout for High-Q Compact Coupling

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Solution Overview

Problem

Existing inductor devices, such as the 8-shaped and double spiral series inductors, face limitations due to large area occupation, low quality factor, high parasitic capacitance, and poor interference resistance, which restrict their application ranges.

Innovation Solution

The proposed inductor device incorporates an 8-shaped inductor structure with first and second spiral wires, interlaced components, and connectors, where the spiral wires are disposed on inner sides of the inductor structure, and the interlaced components are coupled in an interlaced manner across layers, enhancing symmetry and coupling efficiency.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If an 8-shaped inductor structure is used, then the coupling between the inductor and magnetic source occurs at small probability, but the area occupied is larger and the quality factor is low

Engineering Contradiction:
Improvecoupling resistanceVSAvoidarea occupied
Core Design Contradiction:
ReliabilityVSArea of stationary object

Solution Approach 1:

The patent transitions from a planar 8-shaped inductor to a three-dimensional stacked structure with multiple layers. The first and second inductors are positioned on different layers with vertical connections, utilizing the Z-dimension to achieve compact integration while maintaining electromagnetic coupling performance and reducing parasitic effects.

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

Solution Approach 2:

The patent employs a nested configuration where spiral wires are disposed on inner sides of inductor structures, and interlaced components are coupled in an interlaced manner. This nesting approach maximizes the use of available space, reducing the overall area occupied while maintaining inductance and coupling characteristics.

Inventive Principle:
Principle #7Nested doll (Nesting)

2Reliability

If an 8-shaped inductor structure is used, then the coupling between the inductor and magnetic source occurs at small probability, but the parasitic capacitance is large

Engineering Contradiction:
Improvecoupling resistanceVSAvoidparasitic capacitance
Core Design Contradiction:
ReliabilityVSObject-generated harmful factors

Solution Approach 1:

By stacking inductors on multiple layers with vertical interconnections, the patent reduces the horizontal overlap between conductors that would generate parasitic capacitance. The vertical arrangement minimizes capacitive coupling between adjacent traces while maintaining the desired inductive characteristics.

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

Solution Approach 2:

The patent divides the inductor structure into separate first and second inductors on different layers, with discrete connection components. This segmentation allows independent optimization of each inductor's geometry and spacing, reducing unwanted parasitic effects while maintaining the overall coupling performance.

Inventive Principle:
Principle #1Segmentation

3Reliability

If a double spiral series inductor is used, then the quality factor is high and mutual inductance is large, but the shape is asymmetric and interference resistance is poor

Engineering Contradiction:
Improvequality factorVSAvoidinterference resistance
Core Design Contradiction:
ReliabilityVSObject-affected harmful factors

Solution Approach 1:

The patent employs asymmetric spiral wire configurations within each inductor structure, optimizing the winding patterns to achieve high quality factors. The first and second inductors use different spiral arrangements that are optimized for their respective functions while maintaining overall system symmetry through the stacked configuration.

Inventive Principle:
Principle #4Asymmetry

Solution Approach 2:

By placing the first and second inductors on different layers, the patent achieves electromagnetic isolation that improves interference resistance. The vertical separation reduces mutual interference between the inductors while maintaining the high quality factor characteristics of each individual inductor through optimized spiral designs.

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This configuration results in a higher inductance value per unit area with improved quality factor, effectively addressing the limitations of existing inductor designs by providing better coupling and reduced interference, as demonstrated by experimental data showing significant inductance and quality factor values at specific frequencies.

Implementation Method 1

The inductor device includes an 8-shaped inductor structure, a first spiral wire, a second spiral wire... The first spiral wire is disposed on an inner side of the two first-wire...

Methodology Applied
Scientific EffectElectromagnetic induction: Electromagnetic Induction

Implementation Method 2

the first interlaced component is coupled to the first spiral wire and another one of the two second-wires, and the first interlaced component is coupled to the first connector and the second connector in an interlaced manner respectively

Methodology Applied
Scientific EffectMagnetic coupling: Magnetic Field

Data Source

PatentUS11915848B2Inductor device
Publication Date: 2024.02.27 REALTEK SEMICON CORP
  • US11915848B2 patent drawing
  • US11915848B2 patent drawing
  • US11915848B2 patent drawing

AI summary

An inductor device includes an 8-shaped inductor structure, a first spiral wire, a first connector, a second connector, and a first interlaced component. The 8-shaped inductor structure includes two first-wires and two second-wires. The first spiral wire is disposed on an inner side of the two first-wires. The first connector is coupled to one of the two first-wires and one of the two second-wires. The second connector is coupled to another one of the two first-wires. The first interlaced component is coupled to the first spiral wire and another one of the two second-wires, and the first interlaced component is coupled to the first connector and the second connector in an interlaced manner respectively.