AAO Interposer Micro-Bump Structure for Narrow-Pitch Connections
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Solution Overview
Problem
Conventional flip-chip bonding methods using solder bumps face challenges with narrow terminal pitches, leading to increased current and thermal energy densities, and a high likelihood of short-circuits, particularly in miniaturized semiconductor devices and micro-LED displays.
Innovation Solution
An anodic aluminum oxide film-based interposer with through-holes filled by electroplating, using a seed layer and forming conductive and bonding materials to create column-shaped micro-bumps with fine trenches, which reduces current and thermal energy densities and minimizes short-circuit risks.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If the pitch between solder bumps is reduced to accommodate narrower terminal pitches, then the degree of integration of input/output terminals is improved, but the reliability deteriorates due to increased risk of short-circuits between adjacent solder bumps
Solution Approach 1:
The solder bump structure is segmented into multiple functional layers: a spherical solder bump portion for bonding, a column-shaped conductive material portion for electrical connection, and a bonding material portion for attachment. This segmentation allows each layer to perform its specific function optimally, with the column-shaped conductive material providing stable electrical connection while the spherical solder bump ensures reliable bonding, thereby preventing short-circuits even at narrow pitches
Solution Approach 2:
The interposer structure combines multiple materials with different properties: solder material for bonding, conductive material (such as copper) for electrical conduction, and bonding material for mechanical attachment. This composite structure allows optimization of each material's properties for its specific function, achieving both high integration and high reliability in the bump connection part
2Adaptability or versatility
If the size of solder bumps is reduced to accommodate narrower terminal pitches, then the degree of integration of input/output terminals is improved, but the reliability deteriorates due to increased current density and thermal energy density
Solution Approach 1:
The bump connection structure is divided into distinct functional segments: the spherical solder bump for bonding, the column-shaped conductive material for electrical connection, and the bonding material for attachment. This segmentation allows the current and heat to be distributed across multiple materials with different thermal and electrical properties, reducing concentration effects and improving reliability
Solution Approach 2:
The column-shaped conductive material acts as an intermediary between the spherical solder bump and the bonding material, providing a dedicated pathway for electrical connection and heat dissipation. This intermediary structure prevents direct contact between adjacent bumps while maintaining efficient current and thermal energy management
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively manages narrow terminal pitches, reduces current and thermal energy concentrations, and enhances the reliability of electrical connections in semiconductor packages and displays by using anodic aluminum oxide film-based interposers with column-shaped micro-bumps and fine trenches.
Implementation Method 1
forming a first bonding material in each of the through-holes by electroplating using the seed layer; forming an electrically conductive material on the first bonding material by electroplating using the first bonding material; forming a second bonding material on the electrically conductive material by electroplating using the electrically conductive material
Data Source
AI summary
Proposed are an anodic aluminum oxide film-based interposer for electrical connection and a manufacturing method therefor, a semiconductor package and a manufacturing method therefor, a multi-stacked semiconductor device and a manufacturing method therefor, and a display and a manufacturing method therefor that can cope with a narrow pitch between terminals and prevent an increase in current density and thermal energy density in a bump connection part. To this end, proposed is an interposer for electrical connection, in which a through-hole is provided in a body made of anodic aluminum oxide film and a first bonding material, an electrically conductive material, and a second bonding material are formed in the through-hole by electroplating. Here, fine trenches having repeated peaks and valleys in the circumferential direction are provided in an outer circumferential surface of a micro-bump.