ABF Plug Structure for Passive Component Dendrite Mitigation
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
In the fabrication of semiconductor substrates, the use of Ajinomoto Build-up Film (ABF) can lead to delamination of polyimide material from electrode material or passivation layers, and dendrite formation due to thermal stress, which affects the reliability and performance of passive device components.
Innovation Solution
The implementation of an ABF plug component, where the ABF material is strategically positioned between conductive components of passive device components, helps to mitigate delamination and dendrite formation by providing tensile strength and preventing thermal expansion-induced strain.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If ABF material is used in substrate fabrication, then manufacturing cost is reduced and device performance is optimized, but delamination of polyimide material from electrode material or passivation layers occurs due to thermal stress
Solution Approach 1:
The patent introduces a buffer layer positioned between the ABF material and the polyimide material/electrode material interface. This buffer layer acts as an intermediary that absorbs and distributes thermal stress, preventing direct stress transmission that causes delamination. The buffer layer material is specifically selected to have mechanical and thermal properties that bridge the ABF and polyimide layers, thereby maintaining interface integrity while preserving the cost benefits of ABF usage.
Solution Approach 2:
The patent applies a protective coating or cushioning layer to the electrode material or passivation layers before the ABF material is fully integrated. This pre-applied layer provides a stress-absorbing interface that prevents thermal expansion-induced delamination during subsequent thermal processing or operation. The cushioning layer is designed to accommodate thermal stress before it reaches critical interfaces, thereby preventing delamination in advance.
2Ease of manufacture
If ABF material is used in substrate fabrication, then manufacturing cost is reduced, but dendrite formation occurs due to thermal stress
Solution Approach 1:
The buffer layer serves as a mediator that not only prevents delamination but also eliminates the thermal stress conditions that promote dendrite formation. By absorbing and distributing thermal stress uniformly, the buffer layer prevents stress concentration at electrode interfaces, thereby preventing the initiation and growth of dendrites. This maintains the cost advantage of ABF material while eliminating the harmful dendrite formation effect.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The ABF plug component effectively prevents delamination and dendrite formation, enhancing the reliability and performance of passive device components by maintaining the integrity of the insulator and conductive material interfaces under thermal stress.
Implementation Method 1
helps to mitigate delamination and dendrite formation by providing tensile strength and preventing thermal expansion-induced strain
Implementation Method 2
preventing thermal expansion-induced strain
Data Source
AI summary
A passive device of a semiconductor substrate and method of making same. The passive device includes first and second top metal components on a substrate core having an insulator substrate. A passivation layer is formed over the top metal components and insulator substrate. A first conductive component is formed on the passivation layer electrically contacting the first top metal component, as well as a second conductive component that is formed on the passivation layer and electrically contacts the second top metal component. In addition, the device includes an insulator material that is formed over the first conductive component and the second conductive component. A cavity is defined by the insulator material between the first conductive component and the second conductive component. The device further includes an ABF plug component that is formed in the cavity between the first conductive component and the second conductive component.