Ablation Layer Photosensitive Resin Structure Infrared Processing

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Solution Overview

Problem

Existing photosensitive resin structures for flexographic printing face issues such as image blurring due to oxygen inhibition, peeling of the ablation layer, contamination of the developer, and moisture-induced wrinkling, which affect the quality and efficiency of the printing process.

Innovation Solution

An ablation layer for a photosensitive resin structure that includes an anionic polymer with a saponification degree of 0% to 90% and an ester bond in a side chain, capable of being processed by infrared radiation, and designed for improved adhesion and moisture resistance, allowing for easy removal with developers and preventing residue re-adhesion.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If a barrier layer is added to prevent oxygen inhibition, then adhesion is improved, but manufacturing complexity increases and image quality deteriorates due to loss of oxygen permeability

Engineering Contradiction:
ImproveadhesionVSAvoidproduction steps
Core Design Contradiction:
ReliabilityVSDevice complexity

Solution Approach 1:

The patent removes the barrier layer from the structure entirely. Instead of adding a layer to prevent oxygen inhibition, the invention relies on the photosensitive resin composition itself to provide sufficient adhesion without requiring an additional barrier layer, thereby simplifying the structure while maintaining reliability

Inventive Principle:
Principle #2Taking out (Extraction)

Solution Approach 2:

The patent modifies the chemical composition parameters of the photosensitive resin layer by incorporating specific polymers with carboxyl groups and controlling the content of hydrophilic groups. This compositional change enables the resin to achieve adequate adhesion directly, eliminating the need for a separate barrier layer

Inventive Principle:
Principle #35Parameter changes

2Use of energy by moving object

If polyvinyl alcohol is used as ablation layer, then infrared ablation capability is achieved, but moisture absorption causes wrinkling and adhesion problems

Engineering Contradiction:
Improveinfrared ablationVSAvoidmoisture resistance
Core Design Contradiction:
Use of energy by moving objectVSStability of the object's composition

Solution Approach 1:

The patent changes the chemical composition parameters by selecting polymers with specific functional groups (carboxyl, hydroxyl, amine) and controlling the content of hydrophilic groups to 1-20 mass%. This parameter optimization provides sufficient infrared absorption capability while limiting moisture absorption to prevent wrinkling and adhesion issues

Inventive Principle:
Principle #35Parameter changes

Solution Approach 2:

The patent uses composite polymer systems combining different polymer components with complementary properties. The combination of polymers with carboxyl groups, hydroxyl groups, and amine groups creates a composite material that balances infrared ablation capability with moisture resistance through synergistic interactions

Inventive Principle:
Principle #40Composite materials

3Stability of the object's composition

If water-insoluble polyamides are used for ablation layer, then structural stability is improved, but developer contamination and residue accumulation occur

Engineering Contradiction:
Improvestructural stabilityVSAvoiddeveloper contamination
Core Design Contradiction:
Stability of the object's compositionVSObject-generated harmful factors

Solution Approach 1:

The patent optimizes the solubility parameters of the ablation layer by selecting polymers with controlled hydrophilicity (1-20 mass% hydrophilic groups). This parameter adjustment ensures the ablation layer has sufficient structural stability while maintaining adequate solubility in developers to prevent contamination and residue accumulation

Inventive Principle:
Principle #35Parameter changes

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The solution provides a photosensitive resin structure with enhanced adhesion, resistance to moisture-induced wrinkling, and efficient developer removal, resulting in improved image quality and reduced operational complications in the flexographic printing process.

Implementation Method 1

providing a layer that is ablatable by infrared radiation on a photosensitive resin composition layer, and removing the ablation layer that corresponds to a desired image by laser radiation

Methodology Applied
Scientific EffectInfrared absorption: Absorption (EM radiation)

Implementation Method 2

removing the ablation layer that corresponds to a desired image by laser radiation, thereby forming a portion that transmits active light

Methodology Applied
Scientific EffectLaser ablation: Laser Ablation

Implementation Method 3

the curing mechanism of the photosensitive resin structure for the flexographic printing occurs through radical polymerization

Methodology Applied
Scientific EffectRadical polymerization: Photopolymerisation

Implementation Method 4

Because radicals produced during polymerization are deactivated by oxygen, curing tends to proceed slowly near the plate surface that is in contact with air

Methodology Applied
Scientific EffectOxygen inhibition: Absorption (physical)

Data Source

PatentUS8883399B2Ablation layer, photosensitive resin structure, and method for producing relief printing plate using the photosensitive resin structure
Publication Date: 2014.11.11 ASAHI KASEI E-MATERIALS CORPORATION

AI summary

A photosensitive resin structure having an ablation layer for a photosensitive resin for a relief printing that is capable of being processed by infrared radiation and containing an anionic polymer, a relief printing plate is produced by drawing a pattern by irradiating the ablation layer with infrared radiation; exposing the pattern by irradiating the photosensitive resin layer with ultraviolet radiation; and removing the ablation layer and unexposed photosensitive resin layer with a developer.