Abrasive-Free Chemical Planarization With a Porous Pad

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Solution Overview

Problem

Conventional chemical mechanical planarization (CMP) processes are dirty, defect-prone, and unpredictable, leading to yield loss, contamination, and increased maintenance costs due to abrasive slurry and mechanical forces.

Innovation Solution

A method using an abrasive-free planarization solution within a porous pad that selectively removes material from topographically higher substrate portions by controlled contact, utilizing hydrolyzing and complexing agents bonded to the pad, with reduced pressure and slower rotation.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Manufacturing precision

If conventional CMP with abrasive slurry and mechanical forces is used, then material removal and surface smoothing are achieved, but contamination, defects, and process unpredictability increase

Engineering Contradiction:

Improvesurface smoothnessVSAvoidcontamination and defects

Core Design Contradiction:

Manufacturing precisionVSObject-affected harmful factors

Solution Approach 1:

The patent replaces the conventional mechanical abrasion system with a chemical system. The porous pad contains hydrolyzing and complexing agents that chemically react with and remove material from the substrate surface, eliminating the need for abrasive particles and high mechanical forces that cause contamination and defects.

Inventive Principle:

Principle #28Mechanics substitution (Replace mechanical system)

Solution Approach 2:

The patent uses a porous pad structure that allows planarization chemistry to be contained within the pad matrix. The porous structure enables controlled delivery of chemical agents to the substrate surface while preventing debris generation and contamination associated with conventional abrasive slurry systems.

Inventive Principle:

Principle #31Porous materials

2Productivity

If abrasive slurry and high mechanical forces are used for material removal, then planarization is achieved, but maintenance costs and process dirtiness increase

Engineering Contradiction:

Improvematerial removal rateVSAvoidmaintenance costs and cleanliness

Core Design Contradiction:

ProductivityVSEase of manufacture

Solution Approach 1:

The patent substitutes mechanical material removal with chemical reactions. The hydrolyzing agents break down substrate material chemically, and complexing agents facilitate removal, eliminating the need for high mechanical forces and abrasive slurry that require extensive maintenance and cleaning infrastructure.

Inventive Principle:

Principle #28Mechanics substitution (Replace mechanical system)

Solution Approach 2:

The porous pad acts as an intermediary carrier that delivers planarization chemistry directly to the substrate surface. This intermediate system enables controlled chemical delivery without requiring messy abrasive slurry handling and disposal systems.

Inventive Principle:

Principle #24Intermediary (Mediator)

3Manufacturing precision

If conventional CMP processes are used, then surface planarization is achieved, but yield loss increases due to defects and contamination

Engineering Contradiction:

Improvesurface planarityVSAvoidyield

Core Design Contradiction:

Manufacturing precisionVSReliability

Solution Approach 1:

The patent replaces mechanical abrasion with chemical planarization, eliminating the generation of scratches, pits, and other mechanical defects that reduce yield. The chemical reaction process is inherently gentler and produces no mechanical damage to the substrate.

Inventive Principle:

Principle #28Mechanics substitution (Replace mechanical system)

Solution Approach 2:

The patent converts the potential harm of aggressive mechanical removal into a beneficial gentle chemical process. By using hydrolyzing and complexing agents, the system achieves material removal without the harmful mechanical forces that create defects and reduce manufacturing yield.

Inventive Principle:

Principle #22Blessing in disguise (Convert harm into benefit)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

Achieves smoother substrate surfaces without defects, reduces contamination, and enhances process predictability, improving yield and reducing costs by eliminating mechanical abrasion and pad debris.

Implementation Method 1

utilizing hydrolyzing and complexing agents bonded to the pad

Methodology Applied

Scientific EffectHydrolysis: Hydrolysis

Implementation Method 2

utilizing hydrolyzing and complexing agents bonded to the pad

Methodology Applied

Scientific EffectComplexing:

Data Source

PatentUS12593637B2Chemical planarization

Publication Date: 2026.03.31 CHEMPOWER CORP

AI summary

Examples are disclosed that relate to planarizing substrates without use of an abrasive. One example provides a method of chemically planarizing a substrate, the method comprising introducing an abrasive-free planarization solution onto a porous pad, contacting the substrate with the porous pad while moving the porous pad and substrate relative to one another such that higher portions of the substrate contact the porous pad and lower portions of the substrate do not contact the porous pad, and removing material from the higher portions of the substrate via contact with the porous pad to reduce a height of the higher portions of the substrate relative to the lower portions of the substrate.