Abrasive-Free Polishing Fluid for Hard Substrates

Resolve Bottlenecks,
Find Innovative Solutions
Generate Solutions

Solution Overview

Problem

Current fluid compositions for material removal in chemical mechanical planarization processes, such as polishing substrates, face challenges in achieving high material removal rates while maintaining low surface roughness, especially when dealing with hard materials like silicon carbide or diamond, and often require abrasive particles which can introduce inefficiencies.

Innovation Solution

A fluid composition comprising a multi-valent metal borate, an oxidizing agent, and a solvent, which can effectively polish a variety of materials, including hard substrates, at a high material removal rate with low surface roughness without the need for abrasive particles, by leveraging the synergistic effect between the multi-valent metal borate and oxidizing agent.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Productivity

If conventional fluid compositions with abrasive particles are used for polishing hard materials, then material removal rate can be improved, but surface roughness increases and polishing efficiency decreases

Engineering Contradiction:
Improvematerial removal rateVSAvoidsurface roughness
Core Design Contradiction:
ProductivityVSManufacturing precision

Solution Approach 1:

The patent removes abrasive particles from the fluid composition entirely, extracting the harmful element that causes surface roughness while retaining the polishing function through chemical mechanisms involving multi-valent metal borates and oxidizing agents

Inventive Principle:
Principle #2Taking out (Extraction)

Solution Approach 2:

The patent replaces the mechanical abrasion mechanism with a chemical reaction mechanism where multi-valent metal borates and oxidizing agents chemically interact with the substrate surface to enable material removal without mechanical grinding, thereby achieving both high removal rate and smooth surface finish

Inventive Principle:
Principle #28Mechanics substitution (Replace mechanical system)

2Productivity

If abrasive particles are used in fluid composition, then material removal capability is enhanced, but the complexity of the composition and potential for inefficiency increases

Engineering Contradiction:
Improvepolishing efficiencyVSAvoidcomposition complexity
Core Design Contradiction:
ProductivityVSDevice complexity

Solution Approach 1:

The patent extracts and eliminates abrasive particles from the composition, simplifying the fluid formulation to essential chemical components (multi-valent metal borate, oxidizing agent, and solvent) that work synergistically without the complexity associated with abrasive formulations

Inventive Principle:
Principle #2Taking out (Extraction)

Solution Approach 2:

The patent changes the fundamental parameters of the fluid composition from mechanical abrasives to chemical reactants, specifically using multi-valent metal borates with specific oxidation states and complementary oxidizing agents to achieve material removal through controlled chemical reactions rather than mechanical action

Inventive Principle:
Principle #35Parameter changes

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The fluid composition achieves a high material removal rate and low surface roughness on substrates like silicon carbide, outperforming comparative compositions, even when abrasive particles are absent, and demonstrates enhanced polishing efficiency with the combination of iron borate and permanganate as oxidizing agent.

Implementation Method 1

a fluid composition comprising a multi-valent metal borate, at least one oxidizing agent, and a solvent

Methodology Applied
Scientific EffectOxidation: Oxidation

Implementation Method 2

the relative movement of the slurry to a substrate to be polished assists with the planarization (polishing) process by chemically and mechanically interacting with the exterior surface of the substrate

Methodology Applied
Scientific EffectChemical Bonding: Chemical Bonding

Data Source

PatentUS11518913B2Fluid composition and method for conducting a material removing operation
Publication Date: 2022.12.06 SAINT GOBAIN CERAMICS & PLASTICS INC
  • US11518913B2 patent drawing

AI summary

A fluid composition suitable for chemical mechanical polishing a substrate can in include a multi-valent metal borate, at least one oxidizer, and a solvent. The fluid composition can be essentially free of abrasive particles and may achieve a high material removal rate and excellent surface finish.