Abrasive Article with Varying Plane Solidity for Wafer Grinding
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Solution Overview
Problem
The industry demands improved grindstone materials for enhanced grinding performance, particularly in the production of electronic devices where wafers are ground for deposition and post-formation processing.
Innovation Solution
An abrasive article comprising a body with varying plane solidities in different portions, formed by incorporating abrasive particles in a bond material, which includes specific compositions and structures to enhance grinding efficiency.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If uniform abrasive articles are used, then manufacturing is simple, but grinding performance on sensitive materials is insufficient
Solution Approach 1:
The abrasive article incorporates portions with different plane solidities (S1 and S2) to create localized variations in abrasive particle distribution. This allows different regions of the article to provide different grinding characteristics, improving overall grinding performance on sensitive materials while maintaining a relatively simple monolithic structure without complex assemblies
2Manufacturing precision
If abrasive particle distribution is optimized, then post-finishing properties improve, but manufacturing complexity increases
Solution Approach 1:
The invention optimizes post-finishing properties by controlling the plane solidity parameter (S1 vs S2) across different portions of the abrasive article. This parameter variation affects abrasive particle distribution and arrangement, enabling improved surface finish on sensitive materials like silicon carbide and sapphire wafers through a controlled manufacturing process
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The abrasive article provides improved grinding performance and post-finishing properties, particularly suitable for sensitive materials like silicon carbide and sapphire wafers, by optimizing the distribution and arrangement of abrasive particles within the bond material.
Implementation Method 1
A variety of abrasive tools have been developed over the past century for various industries for the general function of removing material from a workpiece, including for example, sawing, drilling, polishing, cleaning, carving, and grinding
Data Source
AI summary
An abrasive article comprising a body including abrasive particles contained in a bond material, wherein the body comprises a first portion having a first plane solidity [S1], a second portion having a second plane solidity [S2], and wherein S1 is different than S2.