Abrasive articles including abrasive particles bonded to an elongated body
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Solution Overview
Problem
Conventional abrasive wire saws face challenges in rapid production due to time-consuming electroplating and sintering processes, and they tend to wear quickly when cutting hard materials, leading to premature failure and high material loss in applications like slicing single crystal ingots for the electronics industry.
Innovation Solution
An abrasive article with an elongated body and a bonding layer containing abrasive grains, where at least 80% of the grains have an average grit size between 1 micron and 100 microns, and an average concentration of 0.02 ct/m to 0.30 ct/m, allowing for efficient cutting through hard materials like sapphire with improved durability and reduced material loss.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If electroplating or sintering is used to attach abrasive particles to the wire, then the abrasive particles are securely bonded, but the production process becomes time-consuming and costly
Solution Approach 1:
The patent extracts and eliminates the time-consuming electroplating and sintering processes from the wire saw manufacturing. Instead, it uses a simplified method where abrasive particles are attached to the wire through a bonding agent applied in a continuous process, removing unnecessary processing steps while maintaining adequate bonding strength for the application
Solution Approach 2:
The patent employs a cost-effective bonding approach using readily available bonding agents rather than expensive electroplating or sintering processes. The wire saw is designed for its intended service life with this simplified bonding method, accepting that the bonding is sufficient for the operational lifespan without requiring the more durable and time-consuming traditional methods
2Productivity
If conventional wire saws are used to cut hard materials like sapphire, then cutting is achieved, but the wire wears quickly and fails prematurely
Solution Approach 1:
The patent changes the parameters of the wire saw system by using a higher concentration of abrasive particles (0.02 to 0.30 ct/m) and a wide grit size distribution (1 to 100 microns) within the bonding layer. This parameter optimization allows the wire to maintain effective cutting capability throughout its service life, achieving both high cutting rates and extended durability when cutting hard materials like sapphire
Solution Approach 2:
The patent creates a composite bonding layer that combines abrasive particles of varying sizes with a bonding agent. This composite structure allows larger grains to perform the primary cutting action while smaller grains fill in and perform finishing work, maintaining cutting efficiency and wire integrity throughout the service life when cutting hard materials
3Productivity
If a high concentration of abrasive grains is used in the bonding layer, then cutting effectiveness is improved, but the bonding layer becomes too dense and flexible wire performance is reduced
Solution Approach 1:
The patent optimizes the abrasive grain concentration parameter to a specific range (0.02 to 0.30 ct/m) that balances cutting effectiveness with wire flexibility. This parameter optimization ensures sufficient abrasive particles are present for effective cutting while maintaining the bonding layer's porosity and the wire's flexibility for proper tensioning and cutting performance
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The abrasive article achieves a cutting rate of at least 0.8 mm/min through 200 cm2 of sapphire with extended cutting lifetime, reducing material loss and production costs by using a wide grit size distribution and optimized bonding and coating layers.
Implementation Method 1
a bonding layer overlying a surface of the elongated body
Data Source
AI summary
An abrasive article comprising an elongated body, a bonding layer overlying a surface of the elongated body, and abrasive grains contained within the bonding layer at an average abrasive grain concentration within a range between about 0.02 ct/m and about 0.30 ct/m.