Absorbing Material Placement in Semiconductor Device
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Solution Overview
Problem
The challenge is to design smaller semiconductor devices that can process increasing amounts of information at higher speeds while maintaining internal environmental integrity and optical functionality, as traditional hermetically sealed housing designs often compromise on size or functionality due to the placement of absorbing materials.
Innovation Solution
Positioning absorbing materials, such as getters and desiccants, under the semiconductor die within the housing allows for reduced device size without interfering with optical operations, maintaining internal environmental control and functionality by relocating the absorbing materials from the top housing to underneath the die or within a separate casing.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If absorbing material is placed on the lid of the housing, then contaminants and moisture are absorbed, but the device size increases and optical functionality is compromised
Solution Approach 1:
The absorbing material is relocated from the traditional horizontal placement on the lid to a vertical placement within a recess in the bottom portion of the housing. This dimensional change allows the absorbing material to be positioned underneath the die, utilizing the vertical space within the housing rather than horizontal space on the lid, thereby reducing the overall device footprint while maintaining absorption functionality.
Solution Approach 2:
The absorbing material is nested within a recess structure in the bottom portion of the housing, allowing it to be contained within the existing housing volume without requiring additional external space. This nesting approach integrates the absorbing material into the housing structure itself, eliminating the need for a larger housing to accommodate separate absorbing material placement.
2Reliability
If absorbing material is placed on the lid of the housing, then contaminants are absorbed, but the glass window must be recessed reducing optical die area
Solution Approach 1:
By moving the absorbing material from the lid area to the bottom portion recess, the optical path through the glass window in the lid is no longer obstructed. The absorbing material now resides in the vertical space beneath the die, allowing the glass window to be flush with the housing surface and maintain full optical functionality without requiring a recess that would reduce the optical die area.
3Volume of moving object
If device size is reduced, then smaller electronic applications are enabled, but absorbing material capacity is insufficient
Solution Approach 1:
The absorbing material is positioned in a recess within the bottom portion of the housing, allowing for optimized packing density and configuration of the absorbing material. This positioning change enables maximum utilization of the available volume within the compact housing, ensuring sufficient absorbing material capacity is achieved within the reduced device size by optimizing the spatial arrangement rather than increasing overall device volume.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enables smaller semiconductor devices with enhanced functionality and environmental control, allowing for increased use in various electronic applications without sacrificing internal integrity or optical capabilities.
Implementation Method 1
absorbing material has been added to the device package as a means of absorbing and holding the contaminants and/or moisture present in the housing
Implementation Method 2
an absorbing material, such as a getter and/or desiccant material
Data Source
AI summary
A semiconductor device is provided that includes a hermetically sealed housing having a top member and a bottom member. A semiconductor die is enclosed within the housing and absorbing material is positioned under the semiconductor die.