Abutment Member Heat Dissipation for Memory Module Boards
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Solution Overview
Problem
Conventional semiconductor devices with memory module boards face challenges in effectively diffusing heat generated by high read/write operations and dense memory cells, leading to temperature rise and potential performance degradation or destruction.
Innovation Solution
A semiconductor device design featuring a module board with pad terminals on one edge and a mother board with contact terminals and an abutment member, where the abutment member, made of high heat conductivity material, mechanically supports the module board and efficiently diffuses heat towards the mother board, suppressing temperature rise.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If memory devices operate at higher read/write speeds and higher density, then productivity and functionality are improved, but heat generation increases causing temperature rise and potential performance degradation
Solution Approach 1:
A heat dissipation member is introduced as an intermediary between the memory devices and the mother board. This member has a heat radiation surface that contacts the memory devices and a heat conduction portion that transfers heat to the mother board, effectively mediating heat transfer and reducing operating temperature while maintaining high-speed operation
Solution Approach 2:
The heat dissipation member extends heat dissipation from the traditional two-dimensional board surface into the third dimension by incorporating a heat radiation surface that protrudes toward the memory devices. This dimensional extension creates additional heat radiation pathways and improves thermal management efficiency
2Temperature
If heat radiation surface area is increased to diffuse heat, then temperature control is improved, but device complexity and space requirements increase
Solution Approach 1:
The heat dissipation member serves multiple functions simultaneously: it provides mechanical support for the memory devices through its holding portion, conducts heat away through its conduction portion, and radiates heat through its radiation surface. This multi-functionality reduces the need for separate components and simplifies the overall device structure
Solution Approach 2:
The heat dissipation member combines the support function and heat dissipation function into a single integrated component. The holding portion supports memory devices while the same structure also serves as the heat conduction path, merging structural and thermal management functions
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively diffuses heat from the module board to the mother board, maintaining the performance of electric components by utilizing high heat conductivity materials and mechanical support, thereby reducing temperature rise and preventing thermal degradation.
Implementation Method 1
the abutment member, made of high heat conductivity material, mechanically supports the module board and efficiently diffuses heat towards the mother board
Data Source
AI summary
A mother board mounts a memory module via a plug-socket coupling, wherein the edge of the memory module has a plug member mounted on a socket member of the mother board. The mother board has a plurality of abutment members abutting the edge surface of the bottom edge of the memory module for which the plug is formed. The abutment members act as ground terminals for connecting the ground layer of the memory module to the ground layer of the mother board, and also act as heat radiation members.