Anisotropic Conductive Adhesive Segmentation for Display Panel Bonding

The adhesive application is segmented into two distinct stages: first applying adhesive to the COF electrode lines, then applying adhesive to the substrate electrode lines. This segmentation ensures that adhesive is only placed where needed (on the electrode lines themselves) rather than being entirely adhered across the entire surface, preventing waste in the gaps between lines while maintaining bonding strength at the connection points.

The patent applies adhesive locally and selectively to the electrode lines rather than uniformly across the entire bonding surface. By using precise application methods (such as screen printing or dispensing) that target only the electrode line regions, the adhesive is placed exactly where electrical and mechanical connection is needed, avoiding waste in the non-conductive gap areas between adjacent electrode lines.

The bonding process is segmented into two separate bonding operations: first bonding the COF to the substrate using adhesive applied to COF electrode lines, then bonding the substrate to the PCB using adhesive applied to substrate electrode lines. This segmentation allows precise control over where adhesive is placed, ensuring it only contacts intended electrode lines and not adjacent lines, thereby eliminating shorting risk while maintaining manufacturing simplicity.

The patent introduces a patterned adhesive layer as an intermediary between the electrode lines and the bonding surfaces. This adhesive layer is applied in a controlled manner only to the electrode line regions, serving as a mediator that enables electrical and mechanical connection without bridging the gaps between adjacent electrode lines, thus preventing shorting while maintaining bonding effectiveness.