Accelerated Test Specification Calculation for Electronic Devices
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Solution Overview
Problem
Existing accelerated stress testing methods for electronic devices are overly generic and do not account for specific device designs or usage conditions, leading to either over-designing or inadequate testing, resulting in unsatisfactory reliability assessment.
Innovation Solution
A method to determine a reliability test specification by calculating the estimated damage an element would suffer under specified conditions, then determining an accelerated test to cause approximately equal damage, considering factors like field use, environmental conditions, and device design, to optimize testing without over-designing.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If generic accelerated test standards are used, then testing can be performed with established protocols, but the device may be over-designed or under-tested due to lack of customization
Solution Approach 1:
The patent transforms generic test parameters into customized parameters by modifying stress levels, cycle counts, and environmental conditions based on specific device characteristics and operational profiles. This allows the test specification to be tailored to each device's actual reliability requirements without using a one-size-fits-all approach.
Solution Approach 2:
The patent performs preliminary calculations of cumulative damage using operational data and device characteristics before establishing the accelerated test specification. This preliminary damage assessment guides the selection of appropriate stress levels and cycle counts, ensuring the test is neither too rigorous nor too lenient before actual testing begins.
2Ease of manufacture
If generic accelerated test standards are applied, then testing procedures are simplified and standardized, but the test may not accurately reflect actual field conditions
Solution Approach 1:
The patent applies local quality by incorporating device-specific characteristics and operational profiles into the test specification. Instead of using uniform generic parameters, the test is customized to reflect the actual stress patterns, environmental conditions, and usage patterns specific to each device type and application.
Solution Approach 2:
The patent creates a simplified copy of actual field operational conditions through accelerated testing. By using operational data to generate representative stress profiles and applying acceleration factors, the patent reproduces the essential characteristics of real-world usage in a compressed test timeframe, balancing fidelity with practicality.
3Productivity
If higher stress levels are applied in accelerated testing, then the test duration is reduced, but the device may be over-tested and require over-design
Solution Approach 1:
The patent applies partial action by using acceleration factors that stress the device beyond normal operational levels but not to the extent of causing premature failure or requiring over-design. The acceleration is calibrated to achieve sufficient testing speed while maintaining a reasonable margin that reflects actual reliability requirements without being excessively harsh.
Solution Approach 2:
The patent performs preliminary damage calculations based on operational data and device characteristics to determine the appropriate acceleration factor. This preliminary assessment ensures that the accelerated stress levels will produce equivalent cumulative damage to what the device would experience in its operational lifetime, preventing both over-testing and under-testing.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach allows for a tailored accelerated test that accurately simulates the damage an electronic device would experience in its lifetime, ensuring proper qualification without unnecessary over-design or under-testing, thus enhancing the reliability assessment of electronic devices.
Implementation Method 1
temperature changes cause stress to solder due to differences in expansion rates of the solder and the material to which the solder is affixed
Implementation Method 2
The stresses that the elements would experience over its lifetime are accelerated by applying high levels of stimuli over a short time period. High levels of stimuli include temperature cycling, thermal shock, and vibration.
Data Source
AI summary
A mechanism is disclosed for determining an accelerated test for a device. The method comprises calculating an estimated amount of damage that an element of the device would suffer if the device were operated under a set of specified conditions over a certain period of time (e.g., expected lifetime of the device). The method further comprises determining an accelerated test to which to subject the element in order to cause the element to suffer an actual amount of damage that is approximately equal to the estimated amount of damage. The accelerated test may be an accelerated test cycle, such as an accelerated temperature cycle.