Acceleration Sensor Movable Electrode Rigidity via Segmented Through-Holes
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Solution Overview
Problem
Existing acceleration sensors with through-holes face a trade-off between air damping reduction and rigidity, where high-frequency vibrations lead to significant air damping and increased rigidity is compromised by forming multiple through-holes.
Innovation Solution
The acceleration sensor employs an SOI substrate with a silicon oxide layer and active silicon layer, featuring a movable electrode supported by elastic beams and through-holes penetrating in the Z-axis direction over the entire surface connected to the elastic beams, arranged in block-shaped areas in a lattice-like pattern to reduce air damping while maintaining rigidity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Object-affected harmful factors
If multiple through-holes are formed in the movable electrode to reduce air damping, then air damping is reduced, but the rigidity of the movable electrode decreases
Solution Approach 1:
The movable electrode is segmented into multiple regions by forming through-holes at specific positions. This segmentation allows air to pass through multiple pathways, significantly reducing air damping effects while the strategic placement of through-holes ensures that structural integrity and rigidity are maintained in critical areas.
Solution Approach 2:
Through-holes are formed selectively at specific local regions of the movable electrode rather than uniformly across the entire structure. This local modification approach reduces air damping in areas where it most affects performance while preserving the rigidity and structural strength of other critical regions.
2Object-affected harmful factors
If a single through-hole is formed in the middle of the structure, then some air damping reduction is achieved, but the air damping effect is insufficient for high-frequency vibrations
Solution Approach 1:
Instead of relying on a single through-hole, the movable electrode is divided into multiple sections with through-holes formed at multiple positions. This segmentation creates multiple air flow pathways that work together to provide sufficient air damping reduction even during high-frequency vibrations, ensuring reliable performance.
Solution Approach 2:
The solution transitions from a single-point through-hole approach to a multi-dimensional arrangement of through-holes distributed across the movable electrode surface. This spatial distribution in multiple dimensions creates a more effective air damping reduction system that handles high-frequency vibrations reliably.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration significantly reduces air damping and maintains the rigidity of the movable electrode, enhancing frequency characteristics and reliability, even under high-frequency accelerations.
Implementation Method 1
through-holes penetrating in a Z-axis direction being formed over the entire surface on the inner side of an outer circumference to which the elastic beams of the movable electrode are connected
Implementation Method 2
a movable electrode supported by elastic beams and configured with a weight
Implementation Method 3
a capacitance semiconductor sensor is proposed as this type of acceleration sensor. In the capacitance semiconductor sensor, movable electrodes are disposed on the front and rear sides of a fixed electrode
Data Source
AI summary
An acceleration sensor can ensure rigidity of its movable electrode despite a large number of through-holes formed in the movable electrode. The acceleration sensor has an SOI substrate in which a silicon oxide layer is formed on a silicon support layer and an active silicon layer is formed on the silicon oxide layer, wherein the active silicon layer of the SOI substrate has a movable electrode supported by elastic beams and configured with a weight, and also has fixed electrodes disposed in a fixed manner around the movable electrode to face the movable electrode, and wherein through-holes penetrating in a Z-axis direction are formed over the entire surface on the inner side of an outer circumference to which the elastic beams of the movable electrode are connected.


