Dual Cooling Systems for Accelerator Back Side Power Delivery
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Solution Overview
Problem
Existing cooling systems for graphics cards and accelerators face challenges in efficiently managing heat generated by back side power delivery components, particularly in high-power applications, which limits performance and requires additional infrastructure.
Innovation Solution
The implementation of a dual cooling system where a first cooling system, including an air-cooled heat sink, cools the front side components, and a second cooling system, with a cooling element and a breakable heat transfer path, cools the back side power delivery components, with direct coupling between the two systems to enhance thermal energy transfer.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If a single cooling system is used for front side components, then the cooling system structure is simple, but the back side power delivery components cannot be effectively cooled
Solution Approach 1:
The cooling system is divided into two separate systems: a front side cooling system for cooling the integrated circuit and power delivery components on the front side, and a back side cooling system for cooling power delivery components on the back side. Each cooling system has its own cooling element positioned to contact the respective components, allowing independent optimization of cooling effectiveness for each side without compromising structural complexity.
2Power
If power delivery components are placed on the back side to increase power handling, then power handling capability increases, but thermal management becomes more difficult
Solution Approach 1:
The solution moves power delivery components from the traditional front side location to the back side of the printed circuit board, utilizing the unused back side area. This dimensional relocation allows the integrated circuit to be cooled from the front while power delivery components are cooled from the back, effectively managing thermal loads for high-power applications without interfering with each other's cooling paths.
3Adaptability or versatility
If air-cooling is used instead of liquid cooling, then infrastructure requirements are reduced, but power handling capability is limited
Solution Approach 1:
The cooling system is segmented into front side and back side independent cooling paths, both using air-cooled heat sinks. This segmentation allows each cooling system to be optimized for air-cooling efficiency while collectively handling high power loads up to 1200 Watts, eliminating the need for liquid cooling infrastructure while maintaining high power handling capability.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enables higher power handling (up to 1200 Watts) with air-cooling, avoids the need for new data center infrastructure, improves structural rigidity, and reduces PCB costs and power delivery network noise, while maintaining compatibility with existing form factors.
Implementation Method 1
a heat transfer path, which may include a breakable heat transfer path configured to transfer the thermal energy
Implementation Method 2
a first cooling system positioned to cool the integrated circuit and the first set of one or more power delivery components on the front side of the printed circuit board, a second cooling system positioned to cool the second set of one or more power delivery components
Data Source
AI summary
A method for cooling accelerators having back side power delivery components can include providing a printed circuit board having a first side that includes an integrated circuit and a first set of one or more power delivery components and a second side that is opposite the first side and that includes a second set of one or more power delivery components. The method can also include positioning a first cooling system to cool the integrated circuit and the first set of one or more power delivery components. The method can further include positioning a second cooling system to cool the second set of one or more power delivery components. Various other methods and systems are also disclosed.