Accessible Metal Clip Power Module for Embedded Chip Diagnostics
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Solution Overview
Problem
Current power semiconductor modules lack effective means for precise determination and measurement of physical conditions, leading to unpredictable failures and reduced availability and lifetime.
Innovation Solution
A power semiconductor module design featuring a substrate with a metallization layer, semiconductor chips bonded to a metal clip, and a mold encapsulation with recesses that expose the clip's planar part, allowing for direct access and protection of the chips, along with a circuit board carrying sensors for diagnostics and thermal management.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the semiconductor chip is completely enclosed by mold encapsulation for protection, then reliability is improved, but measurement precision and accessibility for diagnostics deteriorate
Solution Approach 1:
The mold encapsulation is segmented by creating a recess that divides the encapsulation structure into an enclosed portion and an accessible portion. This allows the semiconductor chip to be both protected by the encapsulation and accessible for measurement through the recess, resolving the contradiction between protection and measurability.
Solution Approach 2:
The recess acts as an intermediary structure that mediates between the need for complete enclosure and the need for accessibility. It provides a controlled access point that allows sensors to measure physical conditions of the semiconductor chip without compromising the overall protective enclosure.
2Measurement precision
If sensors are added for health monitoring and diagnostics, then measurement precision is improved, but device complexity increases
Solution Approach 1:
The recess in the mold encapsulation serves multiple functions: it provides mechanical support for the sensor, creates an accessible measurement interface, and maintains the protective enclosure. This multi-functionality reduces the need for additional separate components, thereby limiting the increase in device complexity while still achieving improved measurement precision.
3Reliability
If the metal clip is fully enclosed in mold encapsulation for protection, then reliability is improved, but ease of operation for diagnostics deteriorates
Solution Approach 1:
The mold encapsulation is segmented to create a recess that exposes the metal clip. This segmentation allows the metal clip to be both protected by the encapsulation material and accessible for diagnostic measurements, resolving the contradiction between protection and ease of operation.
Data Source
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AI summary
A power semiconductor module (10), comprising: a substrate (12) with a metallization layer (14), which is structured; at least one semiconductor chip (18) bonded to the metallization layer (14) with a first side; a metal clip (20), which is a strip of metal, bonded with a first planar part (20a) to a second side of the semiconductor chip (18) opposite to the first side and bonded with a second planar part (20b) to the metallization layer (14); a mold encapsulation (30) at least partially enclosing the substrate (12), the at least one semiconductor chip (18) and the metal clip (20), the mold encapsulation (30) having a recess (32) approaching towards the first planar part (20a) of the metal clip (20); a circuit board (34) attached to the mold encapsulation (30) above the recess (32); wherein the semiconductor chip (18), to which the metal clip (20) is bonded, is completely enclosed by the mold encapsulation (30), the substrate (12) and the metal clip (20); wherein the first planar part (20a) of the metal clip (20) is at least partially exposed by the recess (32); wherein the circuit board (34) carries a sensor (36, 38, 40) accommodated in the recess (32).