Accessory Thermal Coupling to Parent Device for Silent Cooling
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Solution Overview
Problem
Modern accessory devices face cooling challenges due to heat generated by processing and sensing components, with active cooling methods like fans causing noise interference and passive cooling requiring increased size and weight, making them aesthetically unacceptable.
Innovation Solution
The implementation of a thermal circuit that allows accessory devices to transfer heat directly to a parent device via convection, using a device foot with a heat sink and thermal interface material, and magnetic coupling for efficient heat transfer, enabling smaller device sizes without noisy fans.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If active cooling methods like fans are used in accessory devices, then heat dissipation effectiveness is improved, but noise interference increases and device complexity increases
Solution Approach 1:
The invention extracts the cooling function from the accessory device itself and transfers it to the parent device. The accessory device's heat-generating component is thermally coupled to the parent device through a thermal interface, allowing the parent device's larger thermal mass and cooling capabilities to dissipate the accessory's heat, thereby eliminating the need for active cooling components like fans in the accessory device.
Solution Approach 2:
The invention merges the thermal management functions of the accessory device and parent device into a unified system. By creating a thermal circuit that connects the accessory's heat-generating component directly to the parent device's housing or cooling structure, the two devices work together as an integrated thermal management system, combining the accessory's compact form factor with the parent device's superior heat dissipation capabilities.
2Object-affected harmful factors
If passive cooling methods are used in accessory devices, then noise interference is reduced, but device size and weight increase
Solution Approach 1:
The invention extracts the heavy passive cooling components (such as large heat sinks) from the accessory device and relocates the thermal management burden to the parent device. The accessory device only requires minimal thermal interface materials and conductive structures, while the parent device provides the primary heat dissipation capacity through its larger form factor and integrated cooling systems.
3Object-affected harmful factors
If passive cooling methods are used in accessory devices, then noise interference is reduced, but device size increases
Solution Approach 1:
The invention extracts the bulk of the cooling functionality from the accessory device, allowing it to maintain a compact size. The accessory device only needs minimal thermal conduction paths (such as thermally conductive adhesives or interface materials) to transfer heat to the parent device, eliminating the need for large passive heat sinks or extended thermal management structures within the accessory itself.
4Temperature
If thermal circuit components are added to accessory devices, then heat transfer efficiency is improved, but device complexity increases
Solution Approach 1:
The invention introduces thermal interface materials as intermediaries between the accessory device's heat-generating component and the parent device. These interface materials (such as thermally conductive adhesives, pastes, or phase change materials) facilitate efficient heat transfer while requiring minimal structural modification to the accessory device, thereby achieving high heat transfer efficiency without significantly increasing device complexity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution effectively manages heat transfer from accessory devices to parent devices, reducing the need for active cooling and minimizing device size and weight while maintaining aesthetic acceptability.
Implementation Method 1
The contact between the planar portion of the device foot housing and the planar mounting surface completes a thermal circuit that includes the heat-generating component, the device body housing, the device foot housing and the planar mounting surface and that facilitates the transfer of heat from the heat-generating component to the parent device
Implementation Method 2
the planar portion of the device foot housing and planar mounting surface of the parent device each includes magnetic materials that couple the devices together at the respective planar surfaces with sufficient force to facilitate heat transfer between the two devices
Data Source
AI summary
Embodiments enable an accessory device coupled to a parent device to transfer heat directly to the parent device via convection thereby enabling the parent device to help cool the accessory device. The electronic device includes a device body housing coupled to and housing a heat-generating component, a device foot coupled to an exterior surface of the device body housing and a first mating element. The parent device includes a planar mounting surface, and a second mating element adapted to engage with the first mating element of the accessory device to mount the accessory device to the parent device, and brings the planar portion of the device foot housing into contact with the planar mounting surface. The heat-generating component is thermally coupled to the parent device via a thermal circuit comprising the device body house, the device foot, the planar portion thereof, and the planar mounting surface of the parent device.