Acid Cleaning Composition for Semiconductor Device Particle Removal
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Solution Overview
Problem
The miniaturization of semiconductor devices has increased the complexity of manufacturing processes, leading to contamination issues from materials and processes used in semiconductor manufacturing, where fine particles and impurities affect yield and reliability, and existing cleaning methods, such as using propylene glycol monomethyl ether acetate (PGMEA) and propylene glycol methyl ether (PGME), are insufficient in removing particles from semiconductor manufacturing devices.
Innovation Solution
A cleaning composition with an acid component having a pKa of 12 or less is used to efficiently remove particles from semiconductor manufacturing devices, including a method of cleaning a coating film forming device, producing a substrate for lithography, and forming a resist pattern, utilizing an acid component that interacts with metal and ionic impurities to improve substrate defect characteristics.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If propylene glycol monomethyl ether acetate (PGMEA) and propylene glycol methyl ether (PGME) are used for cleaning pipes of semiconductor manufacturing devices, then the cleaning process is simple and cost-effective, but particles in the pipes are not sufficiently removed and silicon wafers are contaminated
Solution Approach 1:
The patent changes the chemical parameter of the cleaning agent by specifying an acid component with pKa of 12 or less. This parameter change enables effective removal of particles from fluororesin molded products while maintaining process simplicity, resolving the contradiction between cleaning effectiveness and process complexity
Solution Approach 2:
The cleaning composition uses a composite approach by combining an acid component (with pKa ≤ 12) with fluorine-substituted solvent. This composite cleaning agent achieves superior particle removal capability compared to conventional single-component cleaners, addressing the insufficient particle removal problem
2Reliability
If fluororesin molded products are used in semiconductor manufacturing devices, then the devices benefit from fluororesin characteristics, but particles are likely to adhere to the surface and submicron particles are difficult to remove
Solution Approach 1:
The patent applies parameter change by selecting an acid component with pKa of 12 or less, which optimally balances particle removal capability with safety toward fluororesin materials. This parameter specification enables effective particle removal from fluororesin surfaces without damaging the resin
Solution Approach 2:
The acid component acts as an intermediary substance that facilitates particle removal from fluororesin surfaces. It mediates between the need for effective particle removal and the need to preserve fluororesin integrity, enabling submicron particle removal while maintaining device reliability
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The cleaning composition effectively removes particles from semiconductor manufacturing devices, enhancing substrate quality by improving defect characteristics and resist film formation on substrates, thereby addressing the contamination issues associated with miniaturization in semiconductor manufacturing.
Implementation Method 1
utilizing an acid component that interacts with metal and ionic impurities to improve substrate defect characteristics
Data Source
AI summary
A cleaning composition which is used for cleaning a coating film forming device, the composition including an acid component having a pKa of 12 or less.