Acid Diffusion Control Agent for Resist Composition

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Solution Overview

Problem

Existing actinic ray-sensitive or radiation-sensitive resin compositions struggle to achieve high pattern resolution and prevent device contamination, especially during high vacuum exposure processes.

Innovation Solution

Incorporating an acid diffusion control agent with a molecular weight of 420 or more and a Hansen solubility parameter distance Ra between 15 MPa0.5 to 45 MPa0.5 into the resin composition, which suppresses pattern collapse and enhances resolution.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Manufacturing precision

If a conventional acid diffusion control agent is used in the resist composition, then the resist composition can be manufactured with standard materials, but the pattern resolution is insufficient and device contamination occurs during high vacuum exposure

Engineering Contradiction:
Improvepattern resolutionVSAvoiddevice contamination
Core Design Contradiction:
Manufacturing precisionVSObject-generated harmful factors

Solution Approach 1:

The invention changes the molecular weight parameter of the acid diffusion control agent to 420 or more and controls the Hansen solubility parameter distance Ra to be within 15-45 MPa^0.5. These parameter changes enable the agent to suppress pattern collapse and prevent device contamination while maintaining manufacturing precision.

Inventive Principle:
Principle #35Parameter changes

Solution Approach 2:

The invention uses a composite approach by combining the acid diffusion control agent with specific molecular weight and solubility parameters with other resist composition components. This composite material design achieves both high pattern resolution and prevention of device contamination during high vacuum exposure.

Inventive Principle:
Principle #40Composite materials

2Object-generated harmful factors

If the molecular weight of the acid diffusion control agent is increased to prevent device contamination, then device contamination is reduced, but the solubility and coating properties may be affected

Engineering Contradiction:
Improvedevice contaminationVSAvoidsolubility and coating properties
Core Design Contradiction:
Object-generated harmful factorsVSEase of manufacture

Solution Approach 1:

The invention precisely controls the molecular weight parameter (420 or more) and the Hansen solubility parameter distance Ra (15-45 MPa^0.5) to balance device contamination prevention with maintaining solubility and coating properties. This parameter optimization ensures high molecular weight agents remain soluble and coat properly.

Inventive Principle:
Principle #35Parameter changes

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The proposed solution achieves high resolution and prevents device contamination by reducing acid diffusion and pattern collapse, while ensuring the solubility and coating properties of the acid diffusion control agent.

Implementation Method 1

an acid diffusion control agent, in which a molecular weight of the acid diffusion control agent is 420 or more, and a distance Ra between a Hansen solubility parameter of the acid diffusion control agent and a Hansen solubility parameter of air is from 15 MPa0.5 to 45 MPa0.5

Methodology Applied
Scientific EffectDiffusion: Diffusion

Implementation Method 2

a compound that generates an acid upon irradiation with actinic rays or radiation

Methodology Applied
Scientific EffectPhotolysis: Photodissociation

Implementation Method 3

a resin having a solubility in a developer, which changes by an action of an acid

Methodology Applied
Scientific EffectChemical reaction: Chemical Bonding

Data Source

PatentUS12265329B2Actinic ray-sensitive or radiation-sensitive resin composition, actinic ray-sensitive or radiation-sensitive film, pattern forming method, and method for manufacturing electronic device
Publication Date: 2025.04.01 FUJIFILM CORP
  • US12265329B2 patent drawing
  • US12265329B2 patent drawing
  • US12265329B2 patent drawing

AI summary

An actinic ray-sensitive or radiation-sensitive resin composition includes a resin having a solubility in a developer, which changes by the action of an acid, a compound that generates an acid upon irradiation with actinic rays or radiation; and an acid diffusion control agent, in which a molecular weight of the acid diffusion control agent is 420 or more, and a distance Ra between a Hansen solubility parameter of the acid diffusion control agent and a Hansen solubility parameter of the air satisfies 15≤Ra≤45.