Acid Diffusion Control Agent for Resist LWR and CDU
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Solution Overview
Problem
Current radiation-sensitive resin compositions face challenges in achieving optimal Line Width Roughness (LWR) and Critical Dimension Uniformity (CDU) performance, especially at sub-40 nm line widths, which are crucial for advanced microfabrication and semiconductor manufacturing.
Innovation Solution
A radiation-sensitive resin composition is developed, comprising a polymer with acid-labile groups and a specific compound represented by formula (1), which includes a group obtained by removing hydrogen atoms from an aromatic ring, with bonded -OH and -COO- groups, and a monovalent radiation-sensitive cation, along with an acid generator and a solvent, to control acid diffusion and improve resist pattern formation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If conventional radiation-sensitive resin compositions are used, then basic resist pattern formation is achieved, but LWR and CDU performance deteriorates at sub-40 nm line widths
Solution Approach 1:
The patent modifies the chemical structure of the acid diffusion control agent by introducing specific functional groups (carboxyl, hydroxyl, carbonyl) and adjusting molecular weight parameters. These parameter changes optimize the acid diffusion length to achieve superior LWR and CDU performance at sub-40 nm line widths while maintaining pattern formation reliability
Solution Approach 2:
The invention creates a composite radiation-sensitive resin composition combining polymer (A) with acid-labile groups and compound (C) as acid diffusion control agent. This composite material integrates multiple functional components to simultaneously achieve sensitivity, LWR, and CDU performance required for advanced microfabrication
2Use of energy by moving object
If acid diffusion length is increased to improve sensitivity, then exposure light sensitivity improves, but LWR performance deteriorates
Solution Approach 1:
The patent precisely controls the acid diffusion length by adjusting the molecular structure parameters of compound (C), including molecular weight (500-5000), and functional group composition. This optimization allows the acid diffusion length to be sufficient for sensitivity while remaining limited enough to maintain low LWR, resolving the trade-off between sensitivity and line width roughness
3Measurement precision
If solubility difference between exposed and unexposed regions is increased, then pattern definition improves, but CDU performance deteriorates
Solution Approach 1:
The patent employs compound (C) as a local acid diffusion control agent that selectively modulates acid distribution in the exposed regions. The compound creates local solubility differences through acid-catalyzed reactions while maintaining overall CDU by limiting excessive acid diffusion, thereby achieving both sharp pattern definition and uniform critical dimensions
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The composition enables the formation of resist patterns with enhanced sensitivity to exposure light and superior LWR and CDU performance, suitable for miniaturization in semiconductor devices, by shortening acid diffusion length and adjusting solubility differences between exposed and unexposed regions.
Implementation Method 1
radiation-sensitive resin compositions for use in microfabrication by lithography generate an acid at a light-exposed region upon irradiation with a radioactive ray, e.g., an electromagnetic wave such as a far ultraviolet ray such as an ArF excimer laser beam (wavelength of 193 nm), a KrF excimer laser beam (wavelength of 248 nm)
Implementation Method 2
a radiation-sensitive resin composition includes: a polymer including a structural unit including an acid-labile group; and the above-mentioned compound... by shortening acid diffusion length
Data Source
AI summary
The radiation-sensitive resin composition contains: a polymer having a structural unit that includes an acid-labile group; and a compound represented by formula (1). In the formula (1), Ar1 represents a group obtained by removing (m+n+2) hydrogen atoms from an aromatic ring of an arene having 6 to 30 carbon atoms; —OH and —COO— are bonded at ortho positions to each other on a same benzene ring on Ar1; and RG represents a group represented by formula (V-1), a group represented by formula (V-2), a group including a lactone structure, a group including a cyclic carbonate structure, a group including a sultone structure, a group including a ketonic carbonyl group, a group including a thiocarbonate group, or a group including a group represented by formula (V-3), or the like.