Acid-Suppressing Resin Composition for Electronic Substrates
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Solution Overview
Problem
Existing optical and electronic component manufacturing processes face challenges in suppressing the generation of free acid, which can deteriorate metal wirings and affect the reliability of electronic devices.
Innovation Solution
A composition comprising a first compound with an acidic group and a polymerizable group, a second compound with a silicon atom and hydrocarbon group, and optionally a third and fourth compound with polymerizable groups, is used to form a resin that fixes acid sources and enhances adhesiveness to inorganic substrates like silicon oxide, preventing acid diffusion and ensuring durability.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If a composition with acidic groups is used to achieve high adhesiveness to inorganic substrates, then adhesion strength is improved, but free acid generation deteriorates metal wirings
Solution Approach 1:
The composition is segmented into multiple functional components: a polymerizable compound with acidic group (provides adhesion), a silane compound (suppresses acid generation through moisture curing), and optionally a carboxylic acid compound (enhances adhesion). This segmentation allows each component to perform its specific function while balancing adhesion needs against acid suppression requirements.
Solution Approach 2:
The invention uses a composite material system combining organic polymerizable compounds with inorganic silane compounds. The silane component reacts with moisture to form crosslinked structures that suppress free acid generation, while the polymerizable acidic compound provides bonding to inorganic substrates. This composite approach resolves the contradiction between needing acid for adhesion and avoiding acid for metal protection.
2Strength
If acid source is mobilized to enhance adhesion to substrates, then bonding strength is improved, but acid diffusion increases causing harmful effects
Solution Approach 1:
The silane compound acts as an intermediary between the acidic polymerizable compound and the environment. It reacts with moisture to form a crosslinked network that traps the acid source, preventing diffusion while maintaining the acidic groups' bonding capability to inorganic substrates. The silane layer mediates between adhesion requirements and acid containment needs.
Solution Approach 2:
The invention changes the chemical state of the acid source from mobile free acid to fixed acid within a crosslinked silane network. By controlling the moisture content and silane concentration, the acid is transformed from a diffusive harmful agent to a fixed bonding functional group, resolving the contradiction between bonding strength and acid diffusion.
3Ease of manufacture
If conventional optical materials are used for cast molding, then manufacturing process is simplified, but free acid generation cannot be suppressed
Solution Approach 1:
The invention changes the chemical composition parameters of the optical material by incorporating silane compounds with specific moisture reactivity. This parameter change enables the material to undergo moisture curing that suppresses free acid generation, while maintaining compatibility with conventional cast molding processes. The material transforms from acid-generating to acid-suppressing through compositional modification.
Solution Approach 2:
The composition uses moisture from the environment (air humidity) as a self-curing agent. The silane compound automatically reacts with ambient moisture to form the protective crosslinked network that suppresses acid generation. This self-service mechanism eliminates the need for additional processing steps or external reagents, maintaining manufacturing simplicity while achieving acid suppression and reliability improvement.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively suppresses acid diffusion and enhances adhesiveness, ensuring the longevity and performance of electronic components by forming a stable resin that prevents metal wiring deterioration and maintains high adhesiveness to substrates.
Implementation Method 1
the second compound is a silane-coupling reagent
Implementation Method 2
a first compound that includes an acidic group and a first polymerizable group; and a second compound that includes a silicon atom, an oxygen atom bonded to the silicon atom, a hydrocarbon group bonded to the oxygen atom, and a second polymerizable group
Data Source
AI summary
A suitable composition for manufacturing components and devices is disclosed.