Acidic Copper Plating Composition for Void-Free High Aspect Ratio Filling
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Solution Overview
Problem
Existing acidic aqueous compositions for electrolytic copper plating face challenges in achieving uniform and void-free copper deposits, especially in structures with high aspect ratios, and often result in uneven surfaces and increased electromigration due to co-deposition of organic additives.
Innovation Solution
An acidic aqueous composition comprising copper (II) ions and specific compounds of Formula (Ia) and (Ib), which provide improved adhesion and reduced organic additive co-deposition, allowing for uniform copper deposition and increased overpotential, thereby enhancing copper filling quality and stability.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If conventional acidic aqueous compositions are used for electrolytic copper plating, then copper deposition can be achieved, but uniform and void-free copper deposits are difficult to obtain in high aspect ratio structures
Solution Approach 1:
The patent modifies the chemical composition parameters of the plating bath by introducing specific compounds (Formula Ia and Formula Ib) with controlled molecular structures and concentrations, thereby changing the deposition characteristics to achieve uniform and void-free copper deposits in high aspect ratio structures
Solution Approach 2:
The patent employs organic additives (compounds of Formula Ia and Formula Ib) as intermediary substances that mediate between the copper ions and the substrate, facilitating uniform deposition and preventing void formation through their specific adsorption and migration characteristics
2Manufacturing precision
If organic additives are added to control decorative and functional characteristics, then copper deposition can be improved, but co-deposition of organic additives increases electromigration
Solution Approach 1:
The patent optimizes the concentration parameters of organic additives to minimal effective levels, changing the compositional parameters to achieve the desired deposit quality while minimizing co-deposition that causes electromigration
Solution Approach 2:
The patent extracts and eliminates unnecessary organic additives from the plating composition, removing only the essential components needed for deposit quality while excluding those that cause harmful co-deposition and electromigration
3Adaptability or versatility
If high aspect ratio structures are plated, then complex geometries can be filled, but variable electric depositing behavior results in uneven surfaces
Solution Approach 1:
The patent adjusts the chemical parameters of the plating bath by introducing specific compounds that modify the deposition kinetics, enabling uniform copper filling of high aspect ratio structures while compensating for variable electric depositing behavior
Solution Approach 2:
The patent employs dynamic control of the plating process through specific organic additives that adapt to varying current densities and deposition conditions, maintaining surface uniformity throughout the filling of complex geometries
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The composition achieves uniform and void-free copper deposits with reduced organic additive content, improved adhesion, and increased overpotential, effectively addressing the challenges of high aspect ratio structures and ensuring adequate stability and plating quality.
Implementation Method 1
electrolytic copper plating (electrolytic deposition of copper)
Implementation Method 2
electrolytic deposition of copper
Data Source
AI summary
The present invention relates to a composition comprising one or a mixture of two or more quinoline-polyethylene glycol containing compound, each quinoline-polyethylene glycol containing compound comprising:one to three quinoline group andone or more polyethylene glycol group,wherein, in each said quinoline-polyethylene glycol containing compound, one to three of said one to three quinoline group is connected via one or more oxygen atom of said one or more polyethylene glycol group via carbon 6 or carbon 8 of said one to three quinoline group.