Acidic Semiconductor Cleaner with Chelating Agents
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Solution Overview
Problem
Current cleaner compositions for semiconductor and display manufacturing fail to effectively remove organic and inorganic particles while preventing copper corrosion and reverse adsorption, especially when using copper wiring materials.
Innovation Solution
An acidic water-based cleaner composition is developed, incorporating amino acid-based chelating agents, organic acids, inorganic acids, alkali compounds, and optional oxidizing agents, with a pH range of 1 to 5, to enhance the removal of metal contaminants and particles, prevent copper corrosion, and adjust etch rates.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If an alkali water-based cleaner composition (pH 8 to 13) is used to remove metal contaminants and particles and prevent copper corrosion, then copper corrosion prevention is improved, but organic particle removing capability and inorganic particle removing capability of particular film material are insufficient
Solution Approach 1:
The patent changes the pH parameter from alkaline (8-13) to acidic (1-5) range, and modifies the chemical composition by introducing amino acid-based chelating agents, organic acids, and inorganic acids. This parameter change enables the cleaner to simultaneously achieve copper corrosion prevention and enhanced organic/inorganic particle removal capability that the alkaline composition could not provide
2Productivity
If a related art cleaner composition is used to remove particles and organic contaminants, then particle removal function is improved, but copper corrosion and reverse adsorption of copper cannot be prevented
Solution Approach 1:
The patent creates a composite cleaner composition containing multiple functional components: amino acid-based chelating agents (for copper complexation and corrosion prevention), organic acids (for particle removal), inorganic acids (for etching and contamination removal), and alkali compounds. This composite formulation enables simultaneous particle removal and copper protection that single-function cleaners cannot achieve
3Productivity
If an acidic water-based cleaner composition is used to remove metal contaminants and particles, then particle removal capability is improved, but copper corrosion and reverse adsorption may occur
Solution Approach 1:
The amino acid-based chelating agent acts as an intermediary substance that forms stable complexes with copper ions. This intermediary mechanism allows the acidic cleaner to remove metal contaminants and particles effectively while the chelating agent simultaneously binds copper ions, preventing both corrosion and reverse adsorption of copper onto the substrate
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The cleaner composition simultaneously removes metal and organic/inorganic particles, improves inorganic particle removability from film materials, prevents copper corrosion, and maintains surface stability, effectively addressing the limitations of existing compositions.
Implementation Method 1
0.01 to 5.0 wt % of amino acid-based chelating agent
Implementation Method 2
0.01 to 1.5 wt % of organic acid; 0.01 to 1.0 wt % of inorganic acid
Implementation Method 3
0.01 to 0.1 wt % of oxidizing agent
Implementation Method 4
0.01 to 5.0 wt % of benzotriazole-based corrosion inhibitor
Data Source
AI summary
There is provided a cleaner composition for a process of manufacturing a semiconductor and a display. The cleaner composition includes 0.01 to 5.0 wt % of amino acid-based chelating agent, 0.01 to 1.5 wt % of organic acid, 0.01 to 1.0 wt % of inorganic acid, 0.01 to 5.0 wt % of alkali compound, and the balance of deionized water and is based on acidic water with pH levels of 1 to 5. The cleaner composition may enhance metal contaminants removal capability and have a function to remove particles and organic contaminants, and prevent corrosion of copper and reverse adsorption of copper. Thus, cleaner composition may be used for various purposes of etching copper, removing residues, and a cleaner by adjusting an etch rate.