Organic Film Polishing Composition for ACL and DLC Films
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Solution Overview
Problem
Current semiconductor technologies face challenges in miniaturization and high integration due to the poor etch resistance of spin-on carbon (SOC) and spin-on hardmask (SOH) films, which require thicker hard masks, leading to increased demand for amorphous carbon layer (ACL) hard masks from chemical vapor deposition (CVD), but these are affected by surface clustering and poor polishing efficiency.
Innovation Solution
An organic film polishing composition comprising abrasive particles with modified surfaces, a polishing accelerator with hydrophilic and hydrophobic groups, and a solvent, which enables high polishing speed and quality on hard carbon-based films like ACL, utilizing electrostatic attraction and surface modification to improve stability and efficiency.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If CVD method is used to form ACL hard mask, then etch resistance is improved, but surface clustering and carbon particles are generated causing yield decrease
Solution Approach 1:
The patent converts the harmful effect of strong carbon-carbon bonds in ACL (which cause chemical inertness and difficulty in polishing) into a benefit by using electrostatic attraction to enable effective polishing. The abrasive particles with surface charge opposite to the hydrophilic group of the polishing accelerator create electrostatic attraction that overcomes the chemical inertness, allowing high polishing speed while maintaining the etch resistance provided by the CVD ACL layer.
2Reliability
If CVD temperature is increased to improve etch resistance, then hardness of ACL is improved, but polishing becomes more difficult
Solution Approach 1:
The patent changes the approach to polishing by introducing electrostatic attraction as a new parameter that overcomes the hardness issue. Instead of relying on mechanical force alone to penetrate the hard ACL layer, the oppositely charged abrasive particles and polishing accelerator create electrostatic attraction that facilitates interaction between the polishing system and the hard carbon layer, enabling effective polishing even at high temperatures where the layer is most hard and etch-resistant.
3Productivity
If abrasive particles are used to polish ACL, then polishing speed is improved, but polishing quality deteriorates with defects and scratches
Solution Approach 1:
The patent introduces a polishing accelerator as an intermediary substance between the abrasive particles and the ACL surface. This accelerator contains a hydrophilic group that interacts with the abrasive particles and a hydrophobic group that interacts with the carbon-based ACL surface. This intermediary mechanism allows the abrasive particles to effectively polish the hard ACL while maintaining high quality by reducing defects and scratches, thus resolving the contradiction between polishing speed and quality.
4Device complexity
If conventional polishing composition is used on ACL, then polishing process is simple, but polishing efficiency is poor due to chemical inertness
Solution Approach 1:
The patent changes the chemical parameters of the polishing system by introducing a polishing accelerator with specific hydrophilic and hydrophobic groups. This accelerator modifies the interaction between the abrasive particles and the chemically inert ACL surface, enabling effective polishing without increasing process complexity. The electrostatic attraction mechanism provides a new parameter that overcomes the chemical inertness, significantly improving polishing efficiency while keeping the process relatively simple.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The composition achieves high polishing speed and quality with reduced defects and scratches on ACL and diamond-like carbon (DLC) films, even at low pressures, improving process efficiency by effectively dispersing debris and maintaining stability.
Implementation Method 1
the surface charge of the abrasive particles is opposite to the charge of the hydrophilic group of the polishing accelerator
Data Source
AI summary
The present disclosure relates to an organic film polishing composition in which a high polishing speed is maintained not only for polymers, an SOC, and an SOH, but also for organic films strongly bonded by covalent bonds such as an amorphous carbon layer (ACL) or a diamond-like carbon (DLC) by including a polishing accelerator containing both a hydrophilic group and a hydrophobic group, and a polishing method using the same.