Anisotropic Conductive Film Floating Electrode for Display Pad Shorts
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Solution Overview
Problem
Display devices are prone to driving failure due to shorts between film attachment pads, which can occur when the anisotropic conductive film (ACF) does not have sufficient floating space or when carbide surfaces and particles on the display panel's side surfaces come into contact with the flexible printed circuit film.
Innovation Solution
Incorporating a third film conductive pattern as a floating electrode in the anisotropic conductive film (ACF) and ensuring the ACF has sufficient floating space, or using a second solder resist layer to cover the side surfaces of the base substrate, thereby preventing direct contact between the carbide surfaces and the flexible printed circuit film.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If the ACF is mounted closely to the display panel to reduce device thickness, then the device becomes more compact, but the floating space of the ACF is insufficient causing shorts between film attachment pads
Solution Approach 1:
The patent introduces a third film conductive pattern as a floating electrode positioned between the first and second film conductive patterns. This intermediary conductive layer prevents direct contact between opposing film attachment pads, eliminating the short circuit risk while allowing the ACF to be mounted closely to the display panel, thus maintaining both compactness and reliability
2Reliability
If the ACF floating space is increased to prevent shorts, then reliability improves, but the device thickness increases
Solution Approach 1:
Instead of increasing floating space in the thickness direction (which would increase device thickness), the patent adds a conductive pattern in the planar dimension by introducing a third film conductive pattern. This dimensional shift allows short prevention without compromising device compactness
3Reliability
If a third film conductive pattern is added as a floating electrode, then shorts between film attachment pads are prevented, but device complexity increases
Solution Approach 1:
The third film conductive pattern serves multiple functions: it acts as a floating electrode to prevent shorts, provides additional electrical connection pathways, and maintains the conductive matrix structure of the ACF. This multi-functionality approach prevents shorts without significantly increasing overall device complexity
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Prevents shorts between film attachment pads and related driving failures by maintaining a sufficient floating space in the ACF and using protective layers to isolate conductive particles, ensuring stable operation of the display device.
Implementation Method 1
an anisotropic conductive film (ACF) disposed on the side surfaces of the touch insulating layers
Implementation Method 2
using a second solder resist layer to cover the side surfaces of the base substrate, thereby preventing direct contact between the carbide surfaces and the flexible printed circuit film
Data Source
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AI summary
A display device (1) includes the following elements: a base substrate (103) having an active area (AAR) and a non-active area (NAR); a plurality of pads (PAD2) disposed on the non-active area (NAR); and a printed circuit (30) disposed on the plurality of pads (PAD2). The printed circuit (30) may include the following elements: a support layer (330); a first conductive layer (320) and a second conductive layer (340) respectively disposed on two opposite surfaces of the support layer (330). The second conductive layer (340) may include the following elements: a first conductive member (341); a second conductive member (342); and a space (SP) between the first conductive member (341) and the second conductive member (342). The first conductive member (341) and the second conductive member (342) may be electrically connected to the first conductive layer (320) through contact holes (CNT2). A side surface of the base substrate (103) may be positioned between two edges of the space (SP) in a direction parallel to the support layer (330).