Anisotropic Conductive Film Heat Generator for Display IC Mounting
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Solution Overview
Problem
In the manufacturing of display devices, existing methods for mounting integrated circuit chips on substrates using anisotropic conductive films face challenges in preventing unnecessary heat exposure to the IC chips, which can cause thermal expansion and misalignment during the electrical connection process.
Innovation Solution
A display device design that incorporates a heat generator on the substrate to supply heat to the anisotropic conductive film, allowing for controlled heat transfer and adhesive layer stiffening, thereby ensuring secure electrical connection without directly applying heat to the IC chip, and includes a conductive line made of nichrome for efficient power application.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If heat is applied to the anisotropic conductive film for softening and hardening to electrically connect the IC chip and electrode pad, then electrical connection is achieved, but the IC chip is unnecessarily affected by heat causing thermal expansion and misalignment
Solution Approach 1:
The heating function is segmented from the IC chip mounting process. A separate heat generator is provided on the substrate to supply heat locally to the anisotropic conductive film, preventing the IC chip from being exposed to unnecessary heat while still achieving the required softening and hardening of the adhesive layer for reliable electrical connection
Solution Approach 2:
The anisotropic conductive film serves as an intermediary that receives heat from the heat generator and transfers it to the adhesive layer, while the IC chip remains protected from direct heat exposure. This mediator approach allows controlled heat transfer to achieve connection without harmful heat exposure to the chip
2Strength
If heat is applied to soften the adhesive layer for mounting, then the IC chip can be securely connected, but thermal expansion occurs causing misalignment
Solution Approach 1:
Heat is applied locally to specific regions where the anisotropic conductive film is positioned, rather than uniformly heating the entire IC chip or substrate. This localized heating approach softens the adhesive layer only where needed for mounting, maintaining alignment precision while achieving sufficient bonding strength
Solution Approach 2:
The heating process is segmented in space and time - heat is applied only to the regions containing the anisotropic conductive film during specific mounting phases, preventing thermal expansion of the IC chip while still achieving the necessary adhesive softening for secure connection
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach prevents unnecessary heat from affecting the IC chip, ensuring precise connection and preventing thermal expansion, thus improving the manufacturing process and reliability of the display device.
Implementation Method 1
a heat generator provided on the substrate configured to come into contact with the anisotropic conductive film to supply heat to the anisotropic conductive film
Implementation Method 2
an anisotropic conductive film configured to electrically connect the pad unit and the integrated circuit chip to each other and including an adhesive layer provided between the pad unit and the integrated circuit chip
Implementation Method 3
The conductive line may include at least one of a current or a power application point, and the at least one of a current or power application point may be located outside the anisotropic conductive film. The conductive line may contain nichrome.
Data Source
AI summary
A display device includes a substrate including a wiring portion, a pad unit provided on the substrate and extended from the wiring portion, an integrated circuit chip electrically connected to the pad unit and mounted on the substrate, and an anisotropic conductive film configured to electrically connect the pad unit and the integrated chip to each other. The anisotropic conductive film includes an adhesive layer provided between the pad unit and the integrated circuit chip and at least one conductive ball scattered in the adhesive layer. A heat generator is also provided on the substrate. The heat generator is configured to come into contact with the anisotropic conductive film to supply heat to the anisotropic conductive film.