Anisotropic Conductive Film Hexagonal Particle Arrangement

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Solution Overview

Problem

Flexible display devices face issues with short-circuits and electric disconnection due to the proximity of conductive particles in anisotropic conductive films, which are exacerbated by substrate deformation during manufacturing processes.

Innovation Solution

The display device incorporates an anisotropic conductive film with conductive particles arranged in a specific pattern, such as virtual regular hexagons with a constant gap, to prevent short-circuits and ensure reliable electrical connections between the pad portions and the printed circuit board, even under deformation.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If conductive particles in anisotropic conductive film are placed close together to ensure electrical connection, then electrical connectivity is improved, but short-circuit risk increases

Engineering Contradiction:
Improveelectrical connection reliabilityVSAvoidshort-circuit risk
Core Design Contradiction:
ReliabilityVSObject-affected harmful factors

Solution Approach 1:

The conductive particles are segmented into discrete units arranged in a regular hexagonal pattern, creating distinct conductive pathways that prevent unintended electrical connections between adjacent particles while maintaining reliable connectivity to pad portions

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The patent applies different spacing characteristics in different directions: constant gap spacing prevents short-circuits between particles, while the hexagonal arrangement optimized along the y-axis ensures reliable electrical connection to pad portions. This directional differentiation of spacing quality resolves the contradiction between connectivity and short-circuit prevention

Inventive Principle:
Principle #3Local quality

2Manufacturing precision

If anisotropic conductive film uses regular particle arrangement to prevent short-circuits, then manufacturing precision is improved, but adaptability to substrate deformation decreases

Engineering Contradiction:
Improveparticle arrangement precisionVSAvoiddeformation tolerance
Core Design Contradiction:
Manufacturing precisionVSAdaptability or versatility

Solution Approach 1:

The patent employs an asymmetric hexagonal arrangement where the longest diagonal is aligned with the y-axis (direction of substrate deformation). This asymmetric orientation allows the structure to accommodate deformation along the y-axis while maintaining precise particle spacing, resolving the contradiction between manufacturing precision and deformation adaptability

Inventive Principle:
Principle #4Asymmetry

3Object-affected harmful factors

If conductive particles are spaced far apart to prevent short-circuits, then short-circuit risk is reduced, but electrical connection reliability deteriorates

Engineering Contradiction:
Improveshort-circuit riskVSAvoidelectrical connection reliability
Core Design Contradiction:
Object-affected harmful factorsVSReliability

Solution Approach 1:

The patent transitions from considering only horizontal particle spacing to incorporating vertical alignment along the y-axis. By arranging particles at apexes of hexagons with longest diagonals parallel to the y-axis, the invention creates a three-dimensional conductive pathway that ensures reliable electrical connection while maintaining safe horizontal spacing to prevent short-circuits

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

Data Source

PatentUS9997487B2Display device with improved anisotropic conductive film
Publication Date: 2018.06.12 SAMSUNG DISPLAY CO LTD
  • US9997487B2 patent drawing
  • US9997487B2 patent drawing
  • US9997487B2 patent drawing

AI summary

A display device includes: a first substrate; a wire portion disposed on the first substrate; a pad portion connected with the wire portion; a printed circuit board facing the first substrate and including an output electrode; and an anisotropic conductive film disposed between the first substrate and the printed circuit board, wherein the anisotropic conductive film comprises a plurality of conductive particles disposed with a constant gap, and the plurality of conductive particles respectively disposed at apexes of virtual regular hexagons in a plan view, with a longest diagonal of the respective virtual regular hexagon being parallel with the y-axis.