Anisotropic Conductive Film with Magnetic Plated Particles
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Solution Overview
Problem
Existing anisotropic conductive films fail to maintain sufficient insulation resistance and particle capturing rate, especially in fine-pitch connections, due to issues with conductive particle chaining and magnetic field applications, leading to short circuits and low conduction resistance.
Innovation Solution
An anisotropic conductive film with conductive particles having a metal plated layer and insulating layer, where 3.0 to 10.0 particles are linked on average, and a magnetic metal plated layer containing Fe, Ni, or Co, with a particle linking rate of 8% to 50%, is used, along with a method involving magnetization and heat-press bonding to achieve effective connections.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If magnetic field is applied to link conductive particles in chain form, then particle capturing rate is improved, but insulation resistance deteriorates causing short circuits
Solution Approach 1:
The magnetic field is applied to exploit the local magnetic quality difference between the magnetic metal plated layer and non-magnetic metal plated layer. This causes particles to orient and link in a controlled directional pattern rather than forming random chains, achieving high particle capturing rate while preventing short circuits through controlled linking geometry
Solution Approach 2:
The magnetic properties of the conductive particles are changed by providing a magnetic metal plated layer, which enables magnetic field application for particle linking. This parameter change (adding magnetic property) allows controlled particle orientation and linking under magnetic field while the non-uniform distribution maintains insulation resistance
2Ease of manufacture
If spherical conductive particles with diameter of several micrometers are used, then ease of manufacture is improved, but insulation resistance between adjacent electrodes deteriorates in fine pitch connections
Solution Approach 1:
The spherical particles maintain ease of manufacture but acquire local quality differences through asymmetric dual-layer metal plating. This local magnetic/non-magnetic differentiation enables controlled particle behavior in fine pitch applications while retaining the manufacturing advantages of spherical geometry
Solution Approach 2:
The spherical conductive particles are transformed into composite structures with dual-layer metal plated layers. This composite design maintains the spherical shape for easy manufacture while adding functional differentiation that enables fine pitch insulation through controlled magnetic linking behavior
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution provides excellent insulation resistance and conduction resistance while maintaining a high particle capturing rate, preventing short circuits and ensuring reliable fine-pitch connections.
Implementation Method 1
a magnetic metal plated layer containing Fe, Ni, or Co
Implementation Method 2
applying a magnetic field to control an oriented state of the conductive particles
Implementation Method 3
heat bonding the two substrates
Data Source
AI summary
To provide an anisotropic conductive film, which contains conductive particles, wherein the anisotropic conductive film is an anisotropic conductive film configured to anisotropic conductively connect a terminal of a substrate with a terminal of an electronic component, wherein the conductive particles are conductive particles, in each of which a metal plated layer and an insulating layer are sequentially provided on a surface of a resin particle, or conductive particles, in each of which an insulating layer is provided on a metal particle, or both thereof, and wherein 3.0 to 10.0 conductive particles are linked together on average.