Anisotropic Conductive Film Connection for Thin Bezel Displays
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Solution Overview
Problem
Conventional display devices with a driver mounted peripherally on the substrate face challenges in miniaturization and bezel thickness due to the need for flexible printed circuits, which limit the display area and increase the device's size and complexity.
Innovation Solution
The implementation of a display device structure that eliminates the flexible printed circuit by using an anisotropic conductive film to electrically connect the driver on the line substrate with the display panel, allowing for a thinner bezel and increased display area through the use of a first and second flexible substrate with a through hole and pad electrode, where the anisotropic conductive film has varying thicknesses to ensure effective electrical connection.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Area of stationary object
If a flexible printed circuit is used to connect the driver with the display panel, then electrical connection is achieved, but the device size increases and display area decreases
Solution Approach 1:
The patent extracts and eliminates the flexible printed circuit from the system by establishing direct electrical connection between the driver and display panel through contact holes formed in the substrate, thereby removing the unnecessary component that occupies space and increases complexity
Solution Approach 2:
The driver and display panel are merged into a single integrated structure where the driver is formed directly on the substrate containing the display panel, eliminating the need for separate connection components and reducing overall device complexity
2Length of stationary object
If a flexible printed circuit is used to connect the driver with the display panel, then electrical connection is achieved, but the bezel thickness increases
Solution Approach 1:
The flexible printed circuit is extracted from the system, eliminating the component that contributes to bezel thickness while maintaining electrical connection functionality through the integrated driver structure
Solution Approach 2:
The electrical connection is achieved by transitioning from a lateral connection approach (using flexible circuit extending across the bezel) to a vertical connection approach (through contact holes penetrating the substrate thickness direction), thereby reducing the horizontal space required
3Length of stationary object
If the insulating substrate is thinned to reduce device thickness, then miniaturization is achieved, but the risk of line substrate breakdown increases
Solution Approach 1:
The substrate is thinned locally only in the specific region where contact holes are formed to establish electrical connection, while other regions maintain their original thickness to provide mechanical strength and prevent breakdown
Solution Approach 2:
The substrate thinning is performed in advance in the contact hole formation region before final assembly, allowing the contact holes to be formed through the thinned region to establish reliable electrical connection while maintaining overall structural integrity
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution enables a compact, thin-bezel display device with an increased display area, improved reliability, and reduced risk of line breakdown, while eliminating the need for long flexible printed circuits, thus enhancing productivity and miniaturization of electronic devices.
Implementation Method 1
an anisotropic conductive film which electrically connects the pad electrode and the connection line
Implementation Method 2
The anisotropic conductive film 3 has a first film thickness in a first position and a second film thickness in a second position, the first film thickness being greater than the second film thickness
Data Source
AI summary
According to one embodiment, a display device includes a first flexible substrate including an insulating substrate with a first area, a second area adjacent to the first area, and a through hole, and a pad electrode, a second flexible substrate including a connection line, the second flexible substrate disposed below the first flexible substrate, and an anisotropy conductive film which electrically connects the pad electrode and the connection line, wherein the anisotropy conductive film is disposed between the second area and the second flexible substrate, and has a first film thickness in a first position and a second film thickness in a second position, where the first film thickness is greater than the second film thickness.