Overmolded Acoustic Array Mounting for Vibration Isolation
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Solution Overview
Problem
Conventional underwater acoustic arrays face sensitivity degradation due to noise and vibration interference, particularly in low-frequency applications mounted on unmanned underwater vehicles (UUVs) or other underwater vehicles, where existing isolation systems are complex and costly.
Innovation Solution
An acoustic array design featuring a base structure with apertures and vibration damping material, encapsulated in an overmold compound, decouples sensors from mounting points, reducing vibration interference by adjusting damping frequencies and using a conformal, neutrally buoyant configuration suitable for UUVs.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Object-affected harmful factors
If conventional isolation systems are used to reduce vibration interference, then vibration noise is reduced, but device complexity and cost increase
Solution Approach 1:
The patent combines the isolation system with the acoustic array housing into a single integrated structure. The isolation material is embedded within the housing walls, eliminating the need for separate isolation components and reducing overall system complexity while maintaining vibration noise reduction effectiveness.
Solution Approach 2:
The patent uses composite materials combining rigid structural components with vibration isolation materials (such as viscoelastic polymers or foam) within the housing. This composite construction provides both structural integrity and vibration damping properties, reducing noise without requiring complex multi-component isolation systems.
2Strength
If rigid mounting is used to secure sensors, then structural strength is improved, but vibration interference increases
Solution Approach 1:
The patent applies different material properties to different parts of the housing: rigid materials in areas requiring structural strength and vibration isolation materials in areas contacting or near sensors. This localized differentiation allows the structure to maintain overall strength while protecting sensitive components from vibration interference.
Solution Approach 2:
The patent introduces an intermediary isolation layer between the rigid housing structure and the sensor mounting points. This intermediate material acts as a buffer that decouples vibration from the sensors while maintaining the structural integrity of the overall housing through the rigid outer shell.
3Measurement precision
If vibration damping material is added to reduce noise, then sensitivity is improved, but device weight increases
Solution Approach 1:
The patent uses thin layers of vibration isolation material integrated into the housing walls rather than bulky damping components. These thin flexible layers provide sufficient vibration reduction for improved sensor sensitivity while minimizing additional weight compared to traditional heavy damping systems.
Solution Approach 2:
The patent optimizes the thickness and material properties of the vibration damping layers to achieve the minimum effective damping required for improved sensitivity. By carefully controlling these parameters, the system achieves adequate noise reduction without excessive weight addition.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively reduces vibration-induced noise, allowing the acoustic array to operate at lower frequencies with improved sensitivity and reduced interference, making it suitable for UUV applications and other low-power or lightweight uses.
Implementation Method 1
portions of vibration damping material in the apertures of the base structure
Implementation Method 2
The mold material serves to encapsulate sensors and associated electronics, isolate them from environmental affects, and simultaneously act as a vibration reducing coupler
Implementation Method 3
a mold material encapsulating the base structure, the sensors and the portions of vibration damping material
Implementation Method 4
The mold material serves to encapsulate sensors and associated electronics, isolate them from environmental affects, and simultaneously act as a vibration reducing coupler
Implementation Method 5
the protrusions comprise a ridge, blocks supported by the base structure to hold wires connecting adjacent ones of the sensors
Data Source
AI summary
Methods and apparatus for reducing vibration for an acoustic array. In an embodiment, an acoustic array includes a base structure having apertures and sensors supported by the base structure for providing an acoustic array. Vibration damping material is located in the apertures of the base structure and attachment mechanisms for secure the portions of vibration damping material to a vehicle. A mold material encapsulates the base structure, the sensors and the portions of vibration damping material. The structure and materials are selected to dampen vibration for certain frequencies.