Additive Fabricated Acoustic Backing with Embedded Conductive Path
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Solution Overview
Problem
Existing acoustic transducers face challenges in achieving matched acoustic qualities between the transducer element and the acoustic backing, and require routing electrical connections to the side, which limits their performance.
Innovation Solution
The method involves additive fabrication to create an acoustic transducer with an electrically conductive path within the backing, using techniques like direct writing, electron beam deposition, or stereo-lithography to form three-dimensional structures, allowing for improved integration and reduced acoustic signal generation at the interface.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If acoustic backing is applied through bonding methods, then acoustic signal attenuation is achieved, but acoustic quality matching between transducer element and backing is poor
Solution Approach 1:
The patent combines the acoustic backing and electrical connection functions into a single integrated structure. The conductive material is embedded within the acoustic backing material itself, merging two previously separate components (backing and electrical connections) into one unified element that performs both acoustic attenuation and electrical signal conduction simultaneously.
Solution Approach 2:
The acoustic backing is designed to perform multiple functions: acoustic signal attenuation, electrical signal conduction, and mechanical support. By incorporating conductive pathways directly into the backing structure, the same component serves both acoustic and electrical purposes, eliminating the need for separate electrical connection elements.
2Ease of operation
If electrical connections are routed to the side of the transducer, then electrical signal transmission is achieved, but device complexity and acoustic interference increase
Solution Approach 1:
The patent transitions from traditional side-mounted electrical connections (lateral routing) to vertical integration where conductive pathways are embedded within the backing structure itself. This dimensional reorganization allows electrical connections to pass through the backing in the same space, eliminating the need for complex side routing and reducing overall device complexity.
Solution Approach 2:
The electrical conductive pathways are nested within the acoustic backing structure. The conductive material is embedded inside the backing material, allowing electrical connections to be contained within the acoustic component rather than requiring external routing paths.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enhances the acoustic transducer's performance by ensuring better signal transmission and reception, reducing acoustic interference, and enabling more efficient electrical signal conduction without the need for side-mounted connections.
Implementation Method 1
a transducer element for converting between one of an electrical signal and an acoustic signal and the other of the electrical signal and the acoustic signal
Implementation Method 2
an additively fabricated backing having an electrically conductive path formed therein configured to conduct the electrical signal
Data Source
AI summary
An acoustic transducer and method of making the acoustic transducer is disclosed. A transducer element for converting a signal between one of an electrical signal and an acoustic signal and the other of the electrical signal and the acoustic signal is provided. A backing to the transducer is additively fabricated to a side of the transducer element. The backing includes an electrically conductive path therein for conducting the electrical signal.