Acoustic Bubble Removal for Display Panels
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Solution Overview
Problem
Existing bubble removal methods for display panels and semiconductor manufacturing, such as those using ultrasonic waves or filters, are ineffective in removing microscopic bubbles without damaging microstructures or increasing maintenance costs.
Innovation Solution
A bubble removal apparatus utilizing acoustic waves that generates a standing or directional acoustic field to collect and transfer bubbles to a specific position, avoiding explosion and minimizing substrate damage, with adjustable phase shifts and movement of the acoustic wave generator.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If ultrasonic waves are used to remove bubbles, then bubbles can be removed without affecting solution transfer, but microscopic bubbles cannot be removed and microstructures are damaged by shock waves
Solution Approach 1:
The patent changes the acoustic wave parameters from conventional ultrasonic frequencies (1 MHz or less) to higher frequencies (10 MHz to 10 GHz), which fundamentally alters the acoustic radiation force characteristics. This parameter change enables the removal of microscopic bubbles (100 nm to 200 μm) while avoiding the shock wave damage to microstructures, as the higher frequency waves generate gentler acoustic radiation forces that are sufficient to remove small bubbles without causing explosion-induced damage.
2Ease of manufacture
If filters are used to remove bubbles, then the configuration is simple and easy to apply, but pressure increases and maintenance cost increases due to filter replacement
Solution Approach 1:
The patent replaces the mechanical filter system with an acoustic field-based bubble removal system. Instead of using a physical filter that creates resistance and requires periodic replacement, the invention uses acoustic radiation force to selectively move and remove bubbles from the liquid crystal solution. This substitution eliminates the need for filters, thereby reducing transfer pressure requirements and eliminating maintenance costs associated with filter replacement, while maintaining simple system configuration.
3Quantity of substance
If conventional ultrasonic waves are used, then bubbles can be removed, but bubbles of microscopic size cannot be removed
Solution Approach 1:
The patent fundamentally changes the acoustic frequency parameter from conventional ultrasonic frequencies (1 MHz or less) to higher frequencies (10 MHz to 10 GHz). This parameter change modifies the acoustic radiation force characteristics, enabling the system to effectively remove microscopic bubbles with diameters of 100 nm to 200 μm. The higher frequency waves generate appropriate acoustic radiation forces that are sufficient to manipulate and remove extremely small bubbles that cannot be removed by conventional ultrasonic waves.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Effectively removes bubbles of various sizes without damaging microstructures, reduces pressure requirements, and minimizes maintenance costs by preventing bubble explosion and optimizing bubble transfer efficiency.
Implementation Method 1
the acoustic wave generator forms a standing acoustic field by generating a pair of acoustic waves of the same wavelength in opposite directions and then superimposing the pair of acoustic waves
Implementation Method 2
collects the bubble at an antinode of the standing acoustic field
Implementation Method 3
removes the bubble from the solution by transferring the bubble to a specific position by adjusting a position of the antinode through a phase shift of the standing acoustic field
Implementation Method 4
an acoustic wave generator provided on the other surface of the substrate and applying an acoustic wave to the solution
Implementation Method 5
removes the bubble from the solution by transferring the bubble to the outside of the solution through a directional acoustic wave applied in one direction of the substrate
Data Source
AI summary
Provided is a bubble removal apparatus for removing a bubble on a substrate during a process of manufacturing a display panel or a semiconductor using a liquid, and more particularly, to a bubble removal apparatus using acoustic waves that collects a bubble on a substrate using an acoustic wave and removes the bubble by moving the bubble to a desired position, and a bubble removal method using the same.