Acoustic Ceiling System with Carrier Layer for Rapid Assembly
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Solution Overview
Problem
Existing acoustic insulated ceiling systems are difficult and time-consuming to assemble and disassemble due to the need for individual connection of ceiling elements to profiles using screws or other connection elements.
Innovation Solution
An acoustic insulated ceiling system comprising a carrier layer suspended between two profiles, with additional layers (bottom, intermediate, and top layers) that can be easily arranged on top of the carrier layer without direct connection to the profiles, utilizing bended edges for secure contact and a keder profile for quick connection, allowing for rapid assembly and disassembly.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If individual ceiling elements are connected to profiles using screws or other connection elements, then the acoustic insulated ceiling system achieves stable connection and structural integrity, but the assembly and disassembly process becomes difficult and time-consuming
Solution Approach 1:
The ceiling system is divided into modular components: a carrier layer with integrated connection elements, and separate acoustic insulation panels. The carrier layer itself is segmented into sections that can be independently connected to profiles, allowing partial assembly and reducing overall assembly time while maintaining connection stability.
Solution Approach 2:
The carrier layer acts as an intermediary component between the profiles and the acoustic insulation panels. It provides integrated connection elements that attach to the profiles, while the acoustic panels simply rest on or attach to the carrier layer, eliminating the need for direct screw connections between panels and profiles.
2Stability of the object's composition
If multiple layers (bottom layer, intermediate layer, top layer) are all individually connected to profiles, then each layer maintains stable positioning, but the complexity of assembly increases significantly
Solution Approach 1:
The connection function for all layers is merged into the carrier layer, which contains integrated connection elements that secure the entire multi-layer structure to the profiles. The bottom layer, intermediate layer, and top layer are stacked together and collectively attached to the carrier layer, reducing the number of separate connection operations required.
Solution Approach 2:
The carrier layer serves multiple functions simultaneously: it provides structural support for all layers, contains integrated connection elements for attaching to profiles, and acts as a unifying substrate that secures the entire multi-layer assembly. This multi-functionality eliminates the need for separate connection mechanisms for each layer.
3Manufacturing precision
If ceiling elements are individually connected using screws, then precise positioning and secure attachment are achieved, but the disassembly process becomes equally complex and time-consuming
Solution Approach 1:
The connection system transitions from a static permanent connection (screws) to a dynamic reversible connection. The carrier layer's integrated connection elements are designed to be easily engaged and disengaged, allowing the system to switch between a secure installed state and a convenient disassembly state without losing positioning precision during installation.
Solution Approach 2:
The connection function is extracted from the individual ceiling panels and concentrated into the carrier layer. This allows the acoustic insulation panels to be simply removed from the carrier layer during disassembly, while the carrier layer remains attached to the profiles, separating the permanent structural connection from the removable insulation elements.
Data Source
AI summary
An acoustic insulated ceiling system is disclosed. The system comprises a first profile and a second profile. The system comprises a carrier layer connected to the first profile and the second profile. As such the carrier layer is suspended between the first profile and the second profile. The system comprises a bottom layer in a high density material. The bottom layer supports on the carrier layer. The bottom layer extends from the first profile to the second profile. The system comprises an intermediate layer in a low density insulation material. The intermediate layer supports on the bottom layer. The system comprises a top layer in a high density material. The top layer supports on the intermediate layer. The top layer extends from the first profile to the second profile.