Acoustic Component Transfer for Precise Fluidic Placement
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Solution Overview
Problem
Current semiconductor assembly equipment is complex and expensive due to the need for heavy mechanical and mechatronic modules, and self-assembly techniques using transfer liquids result in random component placement, losing traceability from the originating semiconductor wafer.
Innovation Solution
A transfer device with acoustic transducers and a controller to create and manipulate acoustic traps in a transfer liquid for precise placement of electronic components on a substrate, allowing for accurate orientation and positioning without the need for complex alignment features.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If acoustic transducers are used to create acoustic traps for precise component placement, then manufacturing precision is improved, but device complexity increases
Solution Approach 1:
The patent replaces traditional mechanical pickup and placement mechanisms with an acoustic field-based system. Acoustic transducers generate acoustic traps that capture and manipulate electronic components through acoustic radiation pressure, eliminating the need for mechanical grippers, pick-up heads, and associated positioning mechanisms. This substitution of mechanical systems with acoustic fields resolves the contradiction by achieving precise component placement without complex mechanical structures.
Solution Approach 2:
The patent introduces acoustic traps as intermediary structures in the transfer liquid that mediate between the acoustic transducers and the electronic components. These acoustic traps serve as temporary holding and manipulation points, allowing precise control of component position and orientation without direct mechanical contact. The acoustic traps act as a mediator that translates acoustic energy into controlled component manipulation, achieving precision while keeping the transducer system manageable.
2Device complexity
If fluidic self-assembly is used for component placement, then device complexity is reduced, but manufacturing precision deteriorates due to random placement
Solution Approach 1:
The patent makes the acoustic traps dynamic and controllable rather than static. The acoustic transducers can be individually activated and their acoustic fields manipulated in real-time to create, move, and position acoustic traps at precise locations. This dynamic control allows the system to maintain the simplicity of fluidic self-assembly while achieving deterministic, precise component placement by actively guiding components to target positions through controlled acoustic trap movement.
Solution Approach 2:
The patent changes the parameters of the acoustic field (frequency, amplitude, phase) to control the position and properties of acoustic traps. By adjusting these acoustic parameters, the system can precisely control where acoustic traps form and how they interact with electronic components, thereby achieving high manufacturing precision while maintaining the simplicity of a fluidic-based approach without complex mechanical systems.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables accurate and efficient placement of electronic components on a substrate, simplifying the assembly process and reducing equipment complexity by using acoustic traps to control the position and orientation of components in a fluidic self-assembly system.
Implementation Method 1
the controller is configured to control the plurality of acoustic transducers to create an acoustic trap in the transfer liquid for capturing the electronic component
Implementation Method 2
manipulate the position and/or orientation of the acoustic trap for the purpose of positioning the electronic component at the placement position on the substrate
Data Source
AI summary
Aspects of the present disclosure relate to a transfer device, system, and method for transferring an electronic component onto a placement position on a substrate. The transfer device is based on a fluidic process principle in which electronic components are transferred in a transfer liquid. In accordance with an aspect of the present disclosure, the transfer device further includes a plurality of acoustic transducers, and a controller for controlling the plurality of acoustic transducers. The controller is configured to control the plurality of acoustic transducers to create an acoustic trap in the transfer liquid for capturing an electronic component when it is released in the transfer liquid and to subsequently manipulate the position and/orientation of the acoustic trap for the purpose of positioning the electronic component at the placement position on the substrate.