Acoustic Duct Sound-Proofing via Compression Element
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Solution Overview
Problem
Existing electronic equipment with microphones faces challenges in achieving sound-proofing of the acoustic duct while maintaining compactness, cost-effectiveness, and recyclability, as current solutions require bulky components and complex assembly that makes replacement and recycling difficult.
Innovation Solution
The design involves separable subassemblies with a thermal pad and compression element to ensure sound-proofing and heat transfer, eliminating the need for adhesive layers and allowing for easy disassembly and replacement of components, using a thermal pad positioned between the cover and heatsink, and a compression element to compress the pad around the acoustic duct.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If thermal adhesive layers are used to connect the cover, heatsink, and printed circuit, then heat transfer is improved, but disassembly and recycling become difficult
Solution Approach 1:
The patent removes the thermal adhesive layer from the connection between the cover and heatsink, extracting the problematic bonding agent that prevented disassembly. The cover and heatsink are now connected mechanically through the rib structure, allowing easy separation while maintaining thermal contact through direct metal-to-plastic contact and the thermal interface material on the printed circuit.
Solution Approach 2:
The patent divides the assembly into separable modules: the cover assembly (cover + heatsink + compression element) and the printed circuit assembly. This segmentation allows independent replacement of the cover without affecting the heatsink or printed circuit, improving repairability and recycling while maintaining effective heat transfer paths.
2Reliability
If screws and foam tubes are used for sound-proofing, then acoustic isolation is improved, but device compactness deteriorates
Solution Approach 1:
The patent combines multiple functions into the rib structure: it provides mechanical connection between cover and heatsink, applies compression force for acoustic sealing, and defines the compression zone for the foam tube. This integration eliminates the need for separate screw fasteners and bulky foam applications, achieving sound-proofing in a compact form.
Solution Approach 2:
The patent uses a thin foam tube (5mm diameter) that is compressed by the rib structure to provide acoustic sealing. The foam acts as a flexible sealing element that can be compressed into a thin profile between the rib and the acoustic duct, providing effective sound isolation without requiring large volumes.
3Stability of the object's composition
If the cover is firmly connected to heatsink and printed circuit, then structural stability is improved, but component replacement and recycling become difficult
Solution Approach 1:
The patent introduces a dynamic compression system where the rib structure applies continuous compressive force to maintain acoustic sealing and thermal contact, but allows for easy release of this compression during disassembly. The compression element can be inserted and removed, providing stable operation during use but easy separation for replacement and recycling.
Solution Approach 2:
The patent introduces a compression element (foam tube or elastomeric material) as an intermediary between the rib structure and the acoustic duct. This intermediary provides the acoustic sealing function while being easily compressible and removable, allowing the cover assembly to be firmly connected during operation but easily separated for replacement without damaging other components.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution provides effective sound-proofing and heat transfer in a compact, inexpensive, and eco-friendly manner, enabling easy replacement and recycling of components without affecting the electronic equipment's performance.
Implementation Method 1
the compression element compresses the thermal pad around the acoustic duct in order to ensure sound-proofing of the acoustic duct
Implementation Method 2
a thermal pad positioned between the cover and heatsink
Data Source
AI summary
Electronic equipment includes a cover including a first hole, a printed circuit having at least one microphone mounted thereon and including a second hole, a heatsink including a third hole, a thermal pad including a fourth hole, and a compression element, the electronic equipment being arranged in such a manner that the first hole, the second hole, the third hole, and the fourth hole together define an acoustic duct that is arranged to enable the microphone to pick up sound signals coming from outside the electronic equipment, and in such a manner that the compression element compresses the thermal pad around the acoustic duct in order to ensure sound-proofing of the acoustic duct.