Acoustic Wave Electrode Shielding for Lower RF Module Height
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Solution Overview
Problem
Existing high frequency modules, such as those described in International Publication No. 2022/102288, face challenges in reducing their size due to the requirement of metal shield walls for isolation, which occupy valuable space.
Innovation Solution
The proposed acoustic wave device includes a substrate with an outer shield layer on its side surfaces and outer connection electrodes on its surface, allowing for reduced module height by eliminating the need for additional metal shield walls and enabling direct contact between the outer connection electrodes and the mount substrate.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If metal shield walls are used for isolation between transmission filter and reception filter, then isolation performance is improved, but module size increases
Solution Approach 1:
The patent merges the shielding function with the connection electrode structure by integrating the outer shield layer directly onto the connection electrodes. This eliminates the need for separate metal shield walls while maintaining isolation performance between transmission and reception filters, thereby reducing module size.
Solution Approach 2:
The connection electrodes are designed to serve dual functions: electrical connection and electromagnetic shielding. By making the shielding function universal to the connection structure itself, the patent eliminates redundant components and reduces overall module volume while maintaining isolation performance.
2Object-affected harmful factors
If metal shield walls are required for isolation, then electromagnetic interference protection is improved, but manufacturing complexity increases
Solution Approach 1:
The patent combines the shielding function with the connection electrode structure by integrating the outer shield layer directly onto the connection electrodes. This eliminates the need for separate metal shield walls while maintaining isolation performance between transmission and reception filters, thereby reducing module size.
Solution Approach 2:
The connection electrodes are designed to serve dual functions: electrical connection and electromagnetic shielding. By making the shielding function universal to the connection structure itself, the patent eliminates redundant components and reduces overall module volume while maintaining isolation performance.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration effectively reduces the size of the high frequency module by utilizing the outer shield layer as a shielding member and allowing for closer proximity between the acoustic wave device and the mount substrate, thereby minimizing the overall module height.
Implementation Method 1
The outer shield layer is arranged on the side surfaces of the substrate... the outer shield layer as a shielding member
Data Source
AI summary
An acoustic wave device includes a substrate, an outer connection electrode arranged on a first principal surface of the substrate, and an outer shield layer arranged on side surfaces of the substrate. The substrate has the first principal surface and a second principal surface that are mutually opposed, and the side surfaces connecting the first principal surface and the second principal surface together. The outer connection electrode has a tip surface exposed.