Acoustic Wave Filter Cap Member Support Bump Design

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Solution Overview

Problem

The challenge in manufacturing thin acoustic wave filter packages is the need for a thicker cap member to prevent deformation during molding, which increases the overall package thickness and is problematic in achieving proper internal pressure.

Innovation Solution

An acoustic wave filter device design featuring a cap member with a support member having bumps on its upper surface, exposed through a passivation layer, and a solder ball protruding above the support member, which helps maintain internal space integrity and prevent cap member deformation during molding.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If a thicker cap member is used to prevent deformation during molding, then the cap member can maintain proper internal pressure, but the overall package thickness increases

Engineering Contradiction:

Improvecap member deformation resistanceVSAvoidpackage thickness

Core Design Contradiction:

ReliabilityVSLength of stationary object

Solution Approach 1:

The invention divides the structural support function into two segments: the cap member itself and the support member with bumps. The support member with protruding bumps provides additional structural reinforcement specifically at critical points, allowing the cap member to be thinner while maintaining overall structural integrity and resistance to deformation during molding.

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

The support member with bumps is pre-formed and integrated with the cap member before the molding process. This preliminary structural reinforcement ensures that when internal pressure increases during molding, the cap member is already supported and less likely to deform, eliminating the need for a thicker cap member design.

Inventive Principle:

Principle #10Preliminary action

2Stress or pressure

If internal pressure is increased during molding, then proper internal pressure for molding is achieved, but cap member deformation may occur

Engineering Contradiction:

Improveinternal pressureVSAvoidcap member stability

Core Design Contradiction:

Stress or pressureVSReliability

Solution Approach 1:

The support member with bumps acts as a cushioning structure that is in place before molding. When internal pressure increases during the molding process, these bumps provide counter-support to the cap member, cushioning it against excessive deformation while still allowing the necessary pressure to be applied for proper molding.

Inventive Principle:

Principle #11Beforehand cushioning (Prior cushioning)

3Reliability

If a polymer with low strain rate is used as cap member, then deformation is avoided, but the cap member thickness must be increased

Engineering Contradiction:

Improvedeformation resistanceVSAvoidcap member thickness

Core Design Contradiction:

ReliabilityVSLength of stationary object

Solution Approach 1:

The structural support function is segmented between the polymer cap member and the support member with bumps. This allows the use of a thinner polymer cap member with low strain rate properties while the support member provides additional reinforcement, achieving deformation resistance without increasing overall thickness.

Inventive Principle:

Principle #1Segmentation

Data Source

PatentUS10432170B2Acoustic wave filter device

Publication Date: 2019.10.01 SAMSUNG ELECTRO MECHANICS CO LTD

AI summary

An acoustic wave filter device includes a filter disposed on a substrate, a wall member disposed on the substrate and surrounding the filter, a cap member disposed on the wall member and bounding an internal space with the wall member; and a support member disposed on the cap member. The support member is disposed above the internal space and includes a bump disposed on the cap member.