Acoustic Filter Package Structure With Sealed Chamber Assembly
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Conventional wafer package structures for acoustic filters are complex, leading to a long and inefficient manufacturing process.
Innovation Solution
A filter package structure comprising a die substrate, a substrate, a solder resist layer, and a conductive structure with seal walls and support electrodes, which forms an enclosed chamber around the filter, ensuring protection and simplifying the manufacturing process by eliminating the need for a wafer-class package structure.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a conventional wafer-class package structure is used to protect the filter, then the filter is protected from external environment impacts, but the package structure becomes complex and the manufacture process takes a long time
Solution Approach 1:
The patent divides the package structure into distinct functional components: a substrate, a filter chip mounted on the substrate, and a sealing structure formed by conductive patterns and solder joints. This segmentation allows each component to be manufactured and prepared separately, then assembled together, simplifying the overall manufacturing process while maintaining protection functionality.
Solution Approach 2:
The substrate serves multiple functions: it provides mechanical support for the filter chip, acts as a platform for mounting and electrical connections, and forms part of the sealed enclosure when combined with the sealing structure. This multi-functionality reduces the need for additional separate components, thereby simplifying the package structure.
2Reliability
If a conventional wafer-class package structure is used to protect the filter, then the filter is protected from external environment impacts, but the manufacturing efficiency is reduced
Solution Approach 1:
The filter chip is prepared and mounted on the substrate before the sealing structure is formed. The conductive patterns are pre-formed on the substrate, and solder joints are established in advance. This preliminary preparation of components and connections allows for more efficient assembly and reduces the overall manufacturing cycle time while ensuring proper sealing and protection.
3Reliability
If a complex wafer package structure is used, then the filter is well protected, but the production period is extended
Solution Approach 1:
The patent combines the sealing function and the electrical connection function into a single integrated structure formed by conductive patterns and solder joints on the substrate. This merging of functions eliminates the need for separate sealing components and connection components, reducing the number of manufacturing steps and shortening the production period while maintaining both protection and electrical connectivity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution enhances the seal effect, reduces manufacturing complexity, shortens the production period, and lowers costs by providing a simpler and more efficient packaging method for acoustic filters.
Implementation Method 1
The conductive structure includes a seal wall and a support electrode, the seal wall and one terminal of the support electrode being connected to the die substrate, and the seal wall and the other terminal of the support electrode being disposed in one of the channels and connected to the substrate via the solder
Data Source
AI summary
A filter package structure includes: a die substrate, a substrate, a solder resist layer, a package layer, and a conductive structure disposed; wherein the solder resist layer is disposed on the substrate, and a plurality of channels are formed in the solder resist layer, each of the channels being provided with a solder; the conductive structure includes a seal wall and a support electrode, the seal wall and one terminal of the support electrode being connected to the substrate via the solder; and the die substrate is provided with a filter, wherein the seal wall is disposed around a periphery of the filter, the die substrate, the substrate and the seal wall enclose to define an enclosed chamber, the support electrode is disposed in the enclosed chamber, and the package layer is disposed on a periphery, far away from the enclosed chamber, of the die substrate.