Acoustic Wave Filter Package With a Shared Ground Node
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Existing acoustic wave filters face challenges in reducing their size while maintaining performance, as decreasing the size of these filters is complex and often results in increased area requirements for additional wiring and connection pads.
Innovation Solution
The proposed solution involves an acoustic wave filter design that includes two shunt resonators from separate acoustic wave filter components, which are electrically coupled to a shared node and ground, allowing for a more compact packaging by sharing a common ground pad and electrically conductive path.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If the size of acoustic wave filter is decreased, then the compactness is improved, but the area required for wiring and connection pads increases
Solution Approach 1:
The patent merges separate ground connections into a shared common ground node. Multiple resonators that would traditionally require individual ground pads and wiring are instead connected to a single shared ground node, eliminating redundant ground connections and reducing the total area required for wiring and connection pads while maintaining electrical performance
Solution Approach 2:
The common ground node serves multiple functions simultaneously: it provides the ground reference for multiple resonators, acts as a shared electrical connection point, and eliminates the need for separate ground pads for each resonator. This multi-functionality reduces the overall footprint of the filter assembly
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design effectively reduces the size of the acoustic wave filter while maintaining performance by minimizing the area required for ground connections and wiring, thus achieving a more compact and efficient filter configuration.
Implementation Method 1
An acoustic wave resonator can include an interdigital transductor electrode on a piezoelectric substrate. The surface acoustic wave resonator can generate a surface acoustic wave on a surface of the piezoelectric layer
Implementation Method 2
A surface acoustic wave resonator can include an interdigital transductor electrode on a piezoelectric substrate. The surface acoustic wave resonator can generate a surface acoustic wave on a surface of the piezoelectric layer
Data Source
AI summary
An acoustic wave filter package is disclosed. The acoustic wave filter package can include a first acoustic wave filter, a second acoustic wave filter, and a shared node. The first acoustic wave filter is configured to filter a first radio frequency signal. The first acoustic wave filter has a first shunt resonator. The second acoustic wave filter is configured to filter a second radio frequency signal. The second acoustic wave filter having a second shunt resonator. The first and second shunt resonators are electrically coupled to ground at the shared node.