Acoustic Wave Filter Shield Layout for Better Heat Dissipation
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Solution Overview
Problem
Existing high frequency modules face challenges in improving heat dissipating characteristics, leading to increased temperature of electronic components such as acoustic wave filters.
Innovation Solution
A high frequency module design featuring a mounting substrate, an acoustic wave filter covered by a resin layer, and a shield layer in contact with the filter's main surface far from the substrate, enhancing heat dissipation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If the acoustic wave filter is covered only by a resin layer, then the manufacturing process is simple, but the heat dissipating characteristics are insufficient leading to temperature increase
Solution Approach 1:
The shield layer is integrated into the existing module structure, serving both as an electromagnetic shield and a heat dissipation path. This merging of functions allows heat to be conducted to the shield layer without adding separate cooling components, thus improving temperature control while maintaining structural simplicity.
Solution Approach 2:
The resin layer acts as an intermediary thermal conductor between the acoustic wave filter and the shield layer. By optimizing the resin layer's thermal conductivity and contact area, heat is effectively transferred to the shield layer which then dissipates heat to the mounting substrate, solving the heat dissipation problem without direct filter-to-substrate contact.
2Temperature
If heat dissipation is improved by adding contact paths, then temperature control improves, but the manufacturing precision requirements increase
Solution Approach 1:
Instead of relying on precise point-contact alignment between the filter and heat dissipation path, the solution uses area contact through the resin layer spreading heat across the shield layer surface. This dimensional transition from point to area contact significantly reduces manufacturing precision requirements while maintaining effective heat dissipation.
3Temperature
If the shield layer is positioned close to the acoustic wave filter, then heat dissipation efficiency improves, but electromagnetic interference may increase
Solution Approach 1:
The shield layer simultaneously performs electromagnetic shielding and heat dissipation functions. By positioning it close to the acoustic wave filter, it provides both thermal conduction path and electromagnetic field containment, resolving the apparent contradiction between heat dissipation efficiency and electromagnetic interference protection.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The design improves heat dissipating characteristics of the acoustic wave filter by allowing heat to be transmitted to the shield layer, effectively reducing temperature buildup.
Implementation Method 1
The shield layer is in contact with a main surface of the acoustic wave filter that is far from the mounting substrate. The shield layer covers the resin layer and the acoustic wave filter. This design improves heat dissipating characteristics of the acoustic wave filter by allowing heat to be transmitted to the shield layer.
Data Source
AI summary
Heat dissipating characteristics of an acoustic wave filter is improved. A high frequency module includes a mounting substrate, an acoustic wave filter, a resin layer, and a shield layer. The mounting substrate has a first main surface and a second main surface that face each other. The acoustic wave filter is arranged near the first main surface of the mounting substrate. The resin layer is arranged on the first main surface of the mounting substrate and covers an outer peripheral surface of the acoustic wave filter. The shield layer covers the resin layer and the acoustic wave filter. The shield layer is in contact with a second main surface of the acoustic wave filter that is far from the mounting substrate.