Acoustic Wave Filter Terminal Layout for Better Heat Dissipation
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Solution Overview
Problem
Ladder-type acoustic wave filters experience poor heat dissipation due to long and low-capacity heat dissipating paths, leading to inadequate heat dissipation performance and low power durability.
Innovation Solution
The design includes a substrate with series and parallel resonators, where at least one terminal overlaps with series resonators in the thickness direction, forming shorter heat dissipating paths through the substrate, and additional heat dissipation paths via through electrodes and solder connections to external terminals, enhancing thermal connectivity and reducing parasitic capacitance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If terminals are located only on the lower surface of the substrate, then the structure is simple, but the heat dissipation path is long and heat dissipation performance is poor
Solution Approach 1:
The patent applies dimensionality change by distributing terminals across both the upper and lower surfaces of the substrate rather than confining them to a single surface. This spatial redistribution creates multiple heat dissipation pathways through the substrate thickness, effectively shortening the thermal conduction distance and improving heat dissipation performance without significantly increasing structural complexity.
2Reliability
If heat dissipation paths are made longer to accommodate terminal connections, then terminal connectivity is achieved, but heat dissipation capacity is reduced
Solution Approach 1:
The patent segments the heat dissipation function by providing multiple independent heat dissipation paths through distributing terminals on both upper and lower surfaces. This segmentation allows heat to travel through multiple parallel routes simultaneously, reducing the effective thermal resistance and improving overall heat dissipation capacity while maintaining reliable terminal connectivity through the substrate.
3Measurement precision
If terminals are positioned away from resonators to reduce parasitic capacitance, then high-frequency characteristics are maintained, but heat dissipation efficiency decreases
Solution Approach 1:
The patent applies local quality by strategically positioning specific terminals (particularly the ground terminal) at optimized locations relative to resonators. The ground terminal is positioned to minimize parasitic capacitance with the resonators, while other terminals are distributed to maximize heat dissipation efficiency. This localized optimization allows different terminal regions to serve different functions simultaneously.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration improves heat dissipation performance and power durability by providing efficient heat dissipation through shorter paths and increased cross-sectional areas, while minimizing parasitic capacitance and maintaining high-frequency characteristics.
Implementation Method 1
ladder-type acoustic wave filters experience poor heat dissipation due to long and low-capacity heat dissipating paths
Implementation Method 2
forming shorter heat dissipating paths through the substrate, and additional heat dissipation paths via through electrodes and solder connections to external terminals
Data Source
AI summary
An acoustic wave device includes: first and second terminals located on a first surface of a first substrate; a third terminal that is located on the first surface and is a ground terminal; series resonators located on a second surface of the first substrate and electrically connected in series with a path between the first and second terminals; a parallel resonator that is located on the second surface and has a first end electrically connected to the path and a second end electrically connected to the third terminal; and a fourth terminal located on the first surface, at least a part of the fourth terminal overlapping with, in a thickness direction of the first substrate, at least one of one or more first series resonators of the series resonators, the one or more first series resonators having both ends to which other series resonators are electrically connected.