Filter integrated circuit
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Solution Overview
Problem
Current filter integrated circuits for high-frequency 5G communication systems face challenges in generating a transmission zero point within the triple fundamental frequency range, which is essential for effectively suppressing unwanted signal harmonics.
Innovation Solution
The integration of an acoustic wave filter chip with a matching circuit on a substrate, featuring adjacent coil inductors that form mutual inductance and parasitic capacitance, enables the generation of a transmission zero point within the triple fundamental frequency range, thereby suppressing double and triple frequency harmonics in the input signal.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If traditional filter circuits are used for high-frequency 5G communication, then basic filtering function is provided, but transmission zero point cannot be generated in triple fundamental frequency range to suppress unwanted harmonics
Solution Approach 1:
The patent combines the matching circuit and acoustic wave filter chip into a single integrated circuit package. The matching circuit includes first and second coil inductors that are adjacent to each other, forming mutual inductance and parasitic capacitance. This merged structure enables the generation of transmission zero points in the triple fundamental frequency range, effectively suppressing unwanted harmonics while providing impedance matching, thereby resolving the limitation of traditional separate filter circuits.
Solution Approach 2:
The patent introduces an intermediary matching circuit between the signal source and the acoustic wave filter chip. This matching circuit, with its specific inductor configuration, acts as a mediator to generate transmission zero points that suppress harmful harmonics. The intermediary structure enables frequency selectivity and harmonic suppression without requiring complex external filtering components.
2Reliability
If acoustic wave filter chip is used alone, then frequency band suppression is achieved, but impedance matching and harmonic suppression in triple fundamental frequency range are insufficient
Solution Approach 1:
The patent merges the matching circuit functionality directly into the integrated circuit package with the acoustic wave filter chip. The matching circuit comprises first and second coil inductors configured to provide impedance matching while simultaneously generating transmission zero points for harmonic suppression. This combined structure enhances both frequency band suppression and impedance matching capabilities within a single integrated package.
3Adaptability or versatility
If separate matching circuit and filter chip are used, then design flexibility is maintained, but circuit complexity and space occupation increase
Solution Approach 1:
The patent integrates the matching circuit and acoustic wave filter chip into a single packaged unit, reducing the number of discrete components and interconnections required. This integration simplifies the overall circuit structure, reduces space occupation, and maintains design flexibility through optimized internal configuration of the matching circuit with adjacent coil inductors that provide both impedance matching and harmonic suppression functions.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration provides effective impedance matching to the acoustic wave filter chip, allowing for the suppression of double and triple frequency harmonics in the input signal, enhancing signal processing and filtering capabilities for high-frequency applications.
Implementation Method 1
The first coil inductor is adjacent to the second coil inductor, so that mutual inductance and parasitic capacitance are formed
Implementation Method 2
The first coil inductor is adjacent to the second coil inductor, so that mutual inductance and parasitic capacitance are formed
Implementation Method 3
The acoustic wave filter chip is covered upon a substrate to suppress signals outside a frequency band
Data Source
AI summary
A filter integrated circuit, including an acoustic wave filter chip and a matching circuit, is provided. The acoustic wave filter chip is covered upon a substrate. The matching circuit is disposed on the substrate to provide matching impedance to the acoustic wave filter chip. A first pad and a second pad of the matching circuit are respectively connected to a first signal terminal and a second signal terminal of the acoustic wave filter chip. First terminals of a first coil inductor and a second coil inductor of the matching circuit are respectively connected to the first pad and the second pad of the substrate. The first coil inductor is adjacent to the second coil inductor, so that mutual inductance and parasitic capacitance are formed, so that the matching circuit and the acoustic wave filter chip jointly generate a transmission zero point located in a triple fundamental frequency range.