Acoustic Flooring Assembly With Non-Penetrating Mechanical Attachment

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Solution Overview

Problem

Conventional flooring elements with mechanical attachment methods, such as nails and screws, penetrate the acoustic layers, causing sound bridges that compromise sound-attenuating properties, particularly in multi-unit buildings where noise transmission is a significant issue.

Innovation Solution

A flooring assembly with a polygonal stability core layer, a sound-attenuating acoustic layer, and an optional finish layer, where the mechanical connection is made through a backing or filler layer, avoiding direct penetration through the acoustic layer, allowing for a non-penetrating mechanical attachment that maintains sound isolation.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Strength

If mechanical attachment elements (nails, staples, bolts, screws) are used to attach flooring assemblies to subfloor substrates, then the flooring assembly achieves secure mechanical attachment and structural stability, but the penetration of acoustic layers with rigid attachment elements creates sound bridges that transmit vibrational energy and sound directly through the acoustic layer, deteriorating sound-attenuating properties

Engineering Contradiction:
Improvemechanical attachment strengthVSAvoidsound transmission through acoustic layer
Core Design Contradiction:
StrengthVSObject-affected harmful factors

Solution Approach 1:

The flooring assembly is segmented into distinct functional layers: a wear layer, a core layer, and an acoustic layer. The mechanical attachment elements are designed to engage only with the core layer, which is acoustically decoupled from the acoustic layer through a damping compound interface. This segmentation allows the attachment function to be separated from the sound attenuation function, enabling secure mechanical attachment without compromising acoustic performance.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

A damping compound is introduced as an intermediary material between the core layer and the acoustic layer. This damping compound serves as a mechanical interface that allows the attachment elements to secure the flooring assembly to the subfloor while simultaneously acting as a sound barrier that blocks the transmission of vibrational energy to the acoustic layer, thereby eliminating sound bridges.

Inventive Principle:
Principle #24Intermediary (Mediator)

2Object-affected harmful factors

If conventional multi-layer composite laminates with acoustic layers are used, then sound-attenuating properties are achieved, but the requirement for rigid mechanical attachment elements penetrates the acoustic layer, creating sound bridges that transmit low-frequency noise and vibrations

Engineering Contradiction:
Improvesound attenuationVSAvoidflooring assembly structure
Core Design Contradiction:
Object-affected harmful factorsVSDevice complexity

Solution Approach 1:

The core layer and acoustic layer are merged into a single integrated flooring element with a unified construction. The attachment elements are configured to engage with the core layer portion of this integrated element, while the damping compound interface ensures that the acoustic layer remains acoustically isolated. This merging eliminates the need for separate acoustic underlayments and complex multi-step installation processes.

Inventive Principle:
Principle #5Merging (Combining)

Solution Approach 2:

The flooring assembly is designed as a universal solution that simultaneously provides structural support, mechanical attachment capability, and sound attenuation. The core layer provides structural integrity and attachment engagement, while the acoustic layer provides sound attenuation, and the damping compound interface provides both mechanical bonding and acoustic decoupling. This multi-functionality is achieved within a single integrated element rather than requiring separate components.

Inventive Principle:
Principle #6Universality (Multi-functionality)

3Length of moving object

If thinner flooring assemblies are designed to reduce material costs and installation time, then cost savings and easier installation are achieved, but maintaining sound-proofing properties without sound-bridging attachment becomes more difficult

Engineering Contradiction:
Improveflooring assembly thicknessVSAvoidsound transmission
Core Design Contradiction:
Length of moving objectVSObject-affected harmful factors

Solution Approach 1:

The attachment elements are designed with modified parameters: they are dimpled or contoured to engage with the core layer at specific contact points rather than penetrating through the entire thickness. The damping compound interface parameters are optimized to provide sufficient mechanical bonding strength while maintaining acoustic isolation. These parameter changes enable the flooring assembly to be thinner while preserving sound attenuation properties.

Inventive Principle:
Principle #35Parameter changes

Data Source

PatentUS10563412B1Acoustic flooring assembly
Publication Date: 2020.02.18 PAIK CARY
  • US10563412B1 patent drawing

AI summary

A flooring assembly comprising a flooring unit comprisinga stability core layer having a plurality of edge surfaces, two of which have an interlocking mechanism for attachment to the edge surfaces of the stability core of adjacent flooring units, anda sound attenuating acoustic layer attached to the bottom surface of the stability core layer.