Acoustic In-Chip Memory via Piezoelectric Transducers
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Solution Overview
Problem
Current semiconductor technologies face limitations in high-density integration, signal interference, and security concerns due to the use of conductive wires, which lead to issues such as spot heating, thermal degradation, and vulnerability to electromagnetic attacks in integrated circuit (IC) chip designs.
Innovation Solution
The implementation of acoustic in-chip communication technology using ultrasound transducers as communication transceivers, which provide wireless ultrasonic communication links between circuit elements, reducing the need for metal interconnects and enabling programmable interconnects, while also serving as built-in circuit sensors for monitoring conditions and concealing circuit functions.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conductive wires are used for signal transmission in integrated circuits, then electrical connectivity and signal transmission are achieved, but spot heating, thermal degradation, and electromagnetic vulnerability occur
Solution Approach 1:
The patent replaces electrical signal transmission through conductive wires with acoustic signal transmission through piezoelectric transducers. Electrical signals are converted to acoustic waves that propagate through the substrate, eliminating the need for extensive metal interconnects and thereby reducing spot heating and electromagnetic vulnerability while maintaining signal transmission capability
Solution Approach 2:
The patent introduces piezoelectric transducers as intermediary devices between electronic units. These transducers convert electrical signals to acoustic signals and back, serving as a mediator that enables communication without direct electrical connections through conductive wires, thus reducing thermal and electromagnetic issues
2Productivity
If metal interconnects are used for high-density integration, then circuit connectivity is achieved, but signal interference and security vulnerabilities increase
Solution Approach 1:
The patent substitutes metal interconnects with acoustic wave propagation through the substrate. By converting electrical signals to acoustic signals via piezoelectric transducers, the system achieves high-density integration without the signal interference and electromagnetic vulnerability inherent in metal wire networks
Solution Approach 2:
The patent extracts and removes metal interconnects from the integrated circuit architecture. By eliminating the need for extensive metal wiring and replacing it with acoustic transmission through the substrate, the system reduces signal interference and security vulnerabilities while maintaining connectivity
3Reliability
If acoustic transducers are used for communication, then metal interconnects are reduced and security is enhanced, but device complexity increases
Solution Approach 1:
The patent makes the piezoelectric transducers multi-functional by using them for both signal transmission and as built-in sensors for monitoring substrate conditions. This universal application reduces the need for separate components, thereby managing device complexity while enhancing security and thermal performance
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach reduces metal interconnects, enhances security by concealing circuit functions, and improves reliability by detecting defects and thermal issues, thereby prolonging the lifespan of IC devices and preventing unauthorized access.
Implementation Method 1
a first piezoelectric transducer and a second piezoelectric transducer disposed on the first and second sides of the substrate, respectively, such that the first piezoelectric transducer is in communication with the first electronic unit, and the second piezoelectric transducer is in communication with the second electronic unit
Implementation Method 2
transmitting the acoustic signal from the first piezoelectric transducer to the second piezoelectric transducer through the bulk of the substrate
Data Source
AI summary
Delay line memory device, systems and methods are disclosed. In one aspect, a delay line memory device includes a substrate; an electronic unit disposed on the substrate and operable to receive, amplify, and/or synchronize data signals into a bit stream to be transmitted as acoustic pulses carrying data stored in the delay line memory device; a first and a second piezoelectric transducer disposed on the substrate and in communication with the electronic unit, in which the first piezoelectric transducer is operable to transmit the data signals to the acoustic pulses that carry the data through the bulk of the substrate, and the second piezoelectric transducer is operable to transduce the received acoustic pulses to intermediate electrical signals containing the data, which are transferred to the electronic unit via an electrical interconnect to cause refresh of the data in the delay line memory device.