Piezoelectric Acoustic Isolator for Bidirectional Data and Power

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Solution Overview

Problem

Existing circuits lack effective methods for electrically isolating components while allowing bidirectional data and power transfer without direct electrical connections, particularly in optocouplers, which are prone to damage from overcurrent or over-voltage conditions.

Innovation Solution

An acoustic isolator using piezoelectric materials on an acoustic medium with transducers that convert electrical signals to acoustic signals and back, enabling bidirectional data and power transfer through acoustic propagation, encapsulated in a semiconductor device with mold compound for protection.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If optocouplers are used for electrical isolation, then electrical isolation is achieved, but the device is prone to damage from overcurrent or over-voltage conditions

Engineering Contradiction:
Improveelectrical isolationVSAvoidovercurrent and over-voltage damage
Core Design Contradiction:
ReliabilityVSObject-affected harmful factors

Solution Approach 1:

The patent introduces an acoustic medium as an intermediary between the input and output circuits. Electrical signals are converted to acoustic signals by a first transducer, transmitted through the acoustic medium, and converted back to electrical signals by a second transducer. This acoustic intermediary provides electrical isolation while being inherently immune to overcurrent and over-voltage damage, as acoustic waves do not conduct electricity.

Inventive Principle:
Principle #24Intermediary (Mediator)

2Adaptability or versatility

If acoustic transducers are used for signal transmission, then bidirectional data and power transfer is enabled, but device complexity increases

Engineering Contradiction:
Improvebidirectional data and power transferVSAvoidtransducer and acoustic medium integration
Core Design Contradiction:
Adaptability or versatilityVSDevice complexity

Solution Approach 1:

The acoustic transducers are designed to perform multiple functions: they can transmit both data signals and power signals bidirectionally through the acoustic medium. The same transducer structure handles both information and energy transfer, eliminating the need for separate communication and power transmission systems, thereby reducing overall system complexity despite the advanced transducer technology used.

Inventive Principle:
Principle #6Universality (Multi-functionality)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

Provides electrical isolation while allowing efficient transfer of data and power signals, protecting components from overcurrent and over-voltage damage.

Implementation Method 1

The acoustic transducers may include piezoelectric materials. One acoustic transducer vibrates in response to an electrical input signal.

Methodology Applied
Scientific EffectPiezoelectric effect: Piezoelectric Effect

Implementation Method 2

The vibrating acoustic transducer causes an acoustic signal to be generated which then propagates through the acoustic medium to another acoustic transducer

Methodology Applied
Scientific EffectAcoustic wave propagation: Sound

Implementation Method 3

another acoustic transducer where the acoustic signal is converted back to an electrical signal

Methodology Applied
Scientific EffectPiezoelectric effect: Converse Piezoelectric Effect

Data Source

PatentUS12356864B2Acoustic isolator
Publication Date: 2025.07.08 TEXAS INSTRUMENTS INC
  • US12356864B2 patent drawing
  • US12356864B2 patent drawing
  • US12356864B2 patent drawing

AI summary

In one example, a semiconductor device includes an acoustic medium, a first transducer on the acoustic medium, a first electrode coupled to the first transducer, a second transducer on the acoustic medium, and a second electrode coupled to the second acoustic transducer. The semiconductor device also includes a semiconductor substrate to support the acoustic medium and first and second transducers. Mold compound encapsulates at least a portion of the acoustic medium, the first acoustic transducer, the second acoustic transducer, and the semiconductor substrate.