Acoustic Mirror Bulk Wave Resonator for Thermal Ruggedness
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Solution Overview
Problem
Laterally excited bulk acoustic wave resonators face challenges with heat dissipation and mechanical ruggedness, particularly in high-frequency applications, where power durability and thermal management are critical, and conventional designs often compromise on resonant characteristics and complexity.
Innovation Solution
The design incorporates a piezoelectric layer between solid acoustic mirrors on a support substrate with high thermal conductivity, where the interdigital transducer electrode excites bulk acoustic waves, and the mirrors confine acoustic energy while the substrates dissipate heat, enhancing mechanical ruggedness and achieving high-frequency resonance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Power
If laterally excited bulk acoustic wave resonators are used in high-frequency applications, then power durability and thermal management become critical, but heat dissipation and mechanical ruggedness are compromised
Solution Approach 1:
The patent introduces solid acoustic mirrors as intermediary structures between the piezoelectric layer and the support substrate. These mirrors serve as thermal conduits that facilitate heat dissipation from the resonator while maintaining acoustic confinement, thus resolving the contradiction between power durability and heat dissipation.
Solution Approach 2:
The support substrate is designed to perform multiple functions simultaneously: providing mechanical support for structural ruggedness and serving as a heat sink for thermal management. This multi-functionality allows the system to achieve both mechanical durability and effective heat dissipation in high-frequency applications.
2Reliability
If solid acoustic mirrors are positioned on the support substrate, then acoustic energy is confined, but the support substrate may be exposed to acoustic energy during operation
Solution Approach 1:
The patent positions the solid acoustic mirrors in a vertical arrangement between the piezoelectric layer and the support substrate, creating acoustic confinement in the vertical dimension. This dimensional arrangement ensures that acoustic energy is trapped within the resonator structure and cannot propagate downward to affect the support substrate.
Solution Approach 2:
The solid acoustic mirrors are designed with specific acoustic impedance characteristics that create preliminary reflection of acoustic waves before they can reach the support substrate. This preliminary anti-action prevents acoustic energy from propagating into the support substrate, protecting it from acoustic exposure.
3Strength
If the piezoelectric layer thickness is increased to improve heat dissipation, then mechanical ruggedness improves, but resonant characteristics and device complexity are affected
Solution Approach 1:
The patent specifies optimized thickness parameters for the piezoelectric layer (0.2-0.4 micrometers) and for the solid acoustic mirror layers (0.14-0.45 wavelengths) to simultaneously achieve mechanical ruggedness and desired resonant characteristics. These parameter changes allow the system to balance structural strength with acoustic performance without excessive complexity.
Solution Approach 2:
The solid acoustic mirrors are designed with localized alternating high and low acoustic impedance layers, where each layer has specific thickness and material properties optimized for its function. This local quality optimization allows the structure to achieve both mechanical ruggedness through the piezoelectric layer and controlled acoustic behavior through the mirrored layers.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration improves heat dissipation and mechanical ruggedness, allowing for high-frequency operation with desirable power durability and a simpler package structure, effectively addressing the limitations of conventional designs.
Implementation Method 1
an interdigital transducer electrode on the piezoelectric layer, where the interdigital transducer electrode is arranged to laterally excite a bulk acoustic wave
Implementation Method 2
The first solid acoustic mirror and the second solid acoustic mirror are arranged to confine acoustic energy of the bulk acoustic wave
Implementation Method 3
a support substrate arranged to dissipate heat associated with the bulk acoustic wave
Data Source
AI summary
A laterally excited bulk acoustic wave device is disclosed. The laterally excited bulk acoustic wave device can include a first solid acoustic mirror, a second solid acoustic mirror, a piezoelectric layer that is positioned between the first solid acoustic mirror and the second solid acoustic mirror, an interdigital transducer electrode on the piezoelectric layer, and a support substrate arranged to dissipate heat associated with the bulk acoustic wave. The interdigital transducer electrode is arranged to laterally excite a bulk acoustic wave. The first solid acoustic mirror and the second solid acoustic mirror are arranged to confine acoustic energy of the bulk acoustic wave. The first solid acoustic mirror is positioned on the support substrate.