Integrated Acoustic and Millimeter Wave Sensor Package
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Solution Overview
Problem
Radar-assisted microphone array applications require complex and bulky equipment due to the need for spatial distribution of multiple microphone and antenna elements, making it challenging to miniaturize these devices effectively.
Innovation Solution
A package structure with integrated acoustic sensor elements on inner surfaces and millimeter wave sensing elements on outer surfaces, along with circuitry for processing signals, is designed to reduce dimensions while maintaining functionality, utilizing a method that includes applying circuitry and sensor elements to substrates and connecting them electrically to form a compact voice recognition system.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If multiple microphone and antenna elements are spatially distributed according to different directions, then the radar-assisted microphone array application can achieve noise reduction and target identification, but the equipment becomes complicated and bulky
Solution Approach 1:
The patent combines multiple acoustic sensor elements and millimeter wave sensing elements into a single integrated package structure. The acoustic sensors are applied to inner surfaces while millimeter wave sensors are applied to outer surfaces, merging what were previously separate distributed components into one compact unit, thereby reducing equipment complexity while maintaining the radar-assisted microphone array functionality for noise reduction and target identification
Solution Approach 2:
The patent utilizes different spatial dimensions and surfaces within the package structure to accommodate different sensor types. Acoustic sensor elements are positioned on inner surfaces facing the interior volume, while millimeter wave sensing elements are positioned on outer surfaces facing the exterior, effectively using vertical and lateral dimensions to separate sensor functions without requiring horizontal spatial distribution, thus reducing device complexity
2Reliability
If multiple microphone and antenna elements are spatially distributed according to different directions, then the radar-assisted microphone array application can achieve voice recognition and noise reduction, but the device dimensions increase
Solution Approach 1:
The patent merges multiple sensor elements into a single integrated package, combining acoustic sensor elements for voice recognition with millimeter wave sensing elements for spatial awareness in one compact structure. This integration dramatically reduces the overall device volume compared to distributed spatial arrangements while preserving both voice recognition and noise reduction capabilities through coordinated sensor processing
Solution Approach 2:
The patent implements a nested arrangement where acoustic sensor elements are positioned on inner surfaces of the package structure, effectively nesting them within the three-dimensional space defined by the package. This nested configuration allows multiple sensors to occupy overlapping projection areas, minimizing the external device dimensions while maintaining internal spatial separation for functional performance
3Volume of moving object
If acoustic sensor elements are placed inside the package structure, then the device dimensions are reduced, but heat management becomes critical for sensor safety
Solution Approach 1:
The patent applies different material properties to different regions of the package structure. The lid or further substrate is configured with specific thermal conductivity characteristics to facilitate heat dissipation from the circuitry to the exterior, while the inner surfaces maintain acoustic transmission properties for the acoustic sensor elements. This localized material optimization enables compact packaging while managing temperature gradients to protect heat-sensitive sensors
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution enables the creation of a miniaturized package that effectively processes acoustic and radar signals, allowing for voice recognition and noise reduction, while optimizing spatial organization and heat management to ensure the safety and efficiency of the acoustic sensor elements.
Implementation Method 1
at least one acoustic sensor element applied to at least one of the inner surfaces, to convert acoustic waves arriving from the exterior of the package into acoustic information in the form of electric signals
Implementation Method 2
a plurality of millimeter wave sensing elements applied to at least one of the outer surfaces, to receive reflected radar signals from objects in the exterior of the package
Data Source
Figure 1
Figure 2
Figure 3a~3b
AI summary
There are provided examples of packages and methods for manufacturing the same. A package (100, 200, 400) as here described may comprise: - a package structure (102, 402) which defines inner surfaces (108a, 110a, 112a) delimiting an inner volume (104) and outer surfaces (108b, 110b, 112b) directed towards an exterior of the package (100, 200, 400); - at least one acoustic sensor element (120) applied to at least one of the inner surfaces (108a, 110a, 112a), to convert acoustic waves arriving from the exterior of the package (100, 200, 400) into acoustic information in the form of electric signals; - a plurality of millimeter wave sensing elements (140) applied to at least one of the outer surfaces (108b, 110b, 112b), to receive reflected radar signals from objects in the exterior of the package (100, 200, 400); and - a circuitry (160) applied to at least one of the inner surfaces (108a, 112a) of the package structure (102, 402), wherein the circuitry (160) is electrically connected to the at least one acoustic sensor element (120) and the plurality of millimeter wave sensing elements (140) to process the acoustic information and the reflected radar signals.