Acoustic Wave Module Support Structure for WLP Heat Dispersion
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Solution Overview
Problem
Acoustic wave devices with wafer level package (WLP) structures face challenges in miniaturization and heat management, as local heat generation varies among functional elements, leading to potential degradation and reduced electric power handling capability due to uneven heat distribution and deformation of the cover portion during sealing.
Innovation Solution
Incorporating a support portion with a smaller height than the outer support layer and a gap between the support and cover portions to disperse heat and prevent contact between the cover and functional elements, allowing for improved sealing and reduced local heat influence.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the hollow space is divided into multiple sections with partition support layers, then the sealing-related handling capability is improved, but the local heat influence increases due to uneven heat distribution in different sections
Solution Approach 1:
The hollow space is divided into multiple sections by partition support layers, which provides structural support during sealing and prevents cover portion deformation. This segmentation improves handling capability while allowing independent heat management in each section.
Solution Approach 2:
Heat dissipation holes are selectively formed in specific partition support layers based on the heat generation characteristics of functional elements in corresponding sections. This local quality approach allows targeted heat dissipation where needed, reducing local heat influence while maintaining the segmentation benefits.
2Manufacturing precision
If functional elements are dispersedly arranged in divided sections, then the cover portion deformation is prevented during sealing, but the electric power handling capability is reduced due to local heat accumulation
Solution Approach 1:
The hollow space is divided into multiple sections by partition support layers, which provides structural support during sealing and prevents cover portion deformation. This segmentation improves handling capability while allowing independent heat management in each section.
Solution Approach 2:
Heat dissipation holes are formed in partition support layers to change the thermal parameters of the structure. This allows heat to be actively managed and dissipated from specific sections, enabling higher power handling capability while maintaining the deformation prevention benefits of segmentation.
3Volume of moving object
If the acoustic wave device is miniaturized with WLP structure, then the device size is reduced, but the heat dissipation capability is worsened due to limited space for heat management
Solution Approach 1:
The partition support layers with integrated heat dissipation holes are nested within the hollow space of the WLP structure. This nesting approach allows heat dissipation functionality to be incorporated within the limited device volume, enabling effective heat management in the miniaturized WLP structure without increasing overall device size.
Data Source
AI summary
An acoustic wave device includes a substrate, functional elements on a first main surface of the substrate, an outer support portion on the substrate around a region where the functional elements are disposed, a cover portion opposed to the first main surface of the substrate with the outer support portion interposed therebetween, a support portion in a hollow space defined by the substrate, the outer support portion, and the cover portion, a wiring pattern electrically connected to the functional elements, and a through electrode extending through the substrate and electrically connected to the wiring pattern. A gap is provided between the support portion and the cover portion. A distance from the first main surface of the substrate to an upper surface of the support portion is greater than a distance from the first main surface of the substrate to an upper surface of the functional elements.