Acoustic Wave Module Support Gap for Heat and Cover Deformation
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Solution Overview
Problem
Acoustic wave devices with wafer level package (WLP) structures face challenges in miniaturization and heat management, as local heat generation varies among functional elements due to different frequencies and current usage, leading to potential degradation and reduced electric power handling capability.
Innovation Solution
Incorporating a support portion within the hollow space of the acoustic wave device with a height smaller than the outer support layer but larger than the functional elements, creating a gap between the support and cover portions to facilitate heat dissipation and prevent element contact during deformation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the hollow space is divided into multiple sections with partition support layers, then the sealing-related handling capability is improved, but local heat accumulation occurs in specific sections
Solution Approach 1:
The hollow space is divided into multiple sections using partition support layers, which provides structural support during sealing operations and prevents cover deformation. This segmentation improves handling capability while allowing heat management in each section.
Solution Approach 2:
Different sections of the hollow space are designed with different heat dissipation characteristics based on the thermal load of functional elements in each section. This allows optimized local heat management while maintaining overall structural integrity.
2Reliability
If functional elements are dispersedly arranged in divided sections, then the cover portion deformation protection is improved, but heat dissipation efficiency decreases
Solution Approach 1:
The hollow space is segmented into multiple sections using partition support layers, which prevents cover deformation and protects functional elements during sealing operations.
Solution Approach 2:
Heat dissipation is enhanced by utilizing vertical airflow paths through the partition support layers, allowing hot air to rise and escape through gaps between the cover and partitions, adding a vertical dimension to heat management.
3Ease of operation
If a support portion is provided in the hollow space, then the handling capability during sealing is improved, but local heat influence increases
Solution Approach 1:
Partition support layers act as intermediary structures that provide mechanical support during sealing operations while simultaneously facilitating heat dissipation through their gap structures and airflow channels.
Solution Approach 2:
The physical parameters of the support structure are optimized by creating gaps between the cover and partition support layers, which changes the thermal and airflow parameters to reduce local heat accumulation while maintaining structural support.
Data Source
AI summary
An acoustic wave device includes a substrate, functional elements on a first main surface of the substrate, an outer support portion on the substrate around a region where the functional elements are disposed, a cover portion opposed to the first main surface of the substrate with the outer support portion interposed therebetween, a support portion in a hollow space defined by the substrate, the outer support portion, and the cover portion, a wiring pattern electrically connected to the functional elements, and a through electrode extending through the substrate and electrically connected to the wiring pattern. A gap is provided between the support portion and the cover portion. A distance from the first main surface of the substrate to an upper surface of the support portion is greater than a distance from the first main surface of the substrate to an upper surface of the functional elements.